公开(公告)号：US20170055352A1

公开(公告)日：2017-02-23

申请号：US15086101

申请日：2016-03-31

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Jun Young LEE

IPC: H05K5/00 ,  H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0215 ,  H05K7/142 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10189 ,  H05K2201/10196

Abstract: A device includes a circuit board, a plastic case accommodating the circuit board therein, the plastic case protecting the circuit board, and a plurality of conductive support members supporting the circuit board such that the circuit board is fixed to the plastic case. In the device, the conductive support members are fixed to the circuit board inside the plastic case, and extend to the outside of the plastic case to be fixed to the plastic case.

Abstract translation: 一种装置包括电路板，容纳电路板的塑料壳，保护电路板的塑料壳和支撑电路板的多个导电支撑构件，使得电路板固定到塑料外壳。 在该装置中，导电支撑构件固定在塑料外壳内的电路板上，并延伸到塑料外壳的外侧以固定在塑料外壳上。