公开(公告)号：US20180272736A1

公开(公告)日：2018-09-27

申请号：US15922398

申请日：2018-03-15

Applicant: SEIKO EPSON CORPORATION

Inventor： Kei TADACHI ,  Satoshi NAGATOYA ,  Hiroyuki TSUCHIYA

IPC: B41J2/175 ,  F16J15/00 ,  B05D5/00 ,  B29C70/80

CPC classification number: B41J2/17596 ,  B05D5/00 ,  B29C70/80 ,  B41J2/17509 ,  B41J2202/05 ,  B41J2202/22 ,  F16J15/00

Abstract: A valve unit includes a flow path member having an opening surface that has a flow path opening of a liquid flow path, a valve having a sealing surface configured to seal the flow path opening, and a sealing member disposed on one of a peripheral portion of the flow path opening in the opening surface and a portion of the sealing surface facing the peripheral portion. The sealing surface is configured to be moved forward and backward relative to the opening surface to open and close the flow path opening. The sealing member is configured to be in contact with the peripheral portion of the flow path opening and the sealing surface when the valve is closed. The sealing member includes a fluorinated polyether.

公开(公告)号：US20180050530A1

公开(公告)日：2018-02-22

申请号：US15660643

申请日：2017-07-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki TSUCHIYA

IPC: B32B37/12 ,  B81C3/00 ,  B41J2/16

CPC classification number: B32B37/12 ,  B32B2307/538 ,  B41J2/161 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1628 ,  B81B2201/052 ,  B81C3/001 ,  B81C2203/032 ,  C09J5/00

Abstract: A manufacturing method of a joined body in which a plurality of structures are joined to each other, the method including forming of an adhesive layer on one face of a medium; adjusting of viscosity of the adhesive layer formed in the forming of the adhesive layer; transcribing the adhesive layer of which viscosity is adjusted in the adjusting of viscosity to the structure; and measuring of surface roughness of the adhesive layer on a transcribing film in a stage before the transcribing.

公开(公告)号：US20170334207A1

公开(公告)日：2017-11-23

申请号：US15671035

申请日：2017-08-07

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki TSUCHIYA ,  Yasuhide MATSUO ,  Kenji OTSUKA ,  Minehiro IMAMURA ,  Tomohiro HAYASHI ,  Kei TADACHI

IPC: B41J2/16 ,  C09J183/04 ,  C08G77/00

CPC classification number: B41J2/1632 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1626 ,  C08G77/80 ,  C09J183/04

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

公开(公告)号：US20150239223A1

公开(公告)日：2015-08-27

申请号：US14632801

申请日：2015-02-26

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroyuki TSUCHIYA ,  Yasuhide MATSUO ,  Kenji OTSUKA ,  Minehiro IMAMURA ,  Tomohiro HAYASHI ,  Kei TADACHI

IPC: B32B37/12 ,  B32B37/18 ,  B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1632 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1626 ,  C08G77/80 ,  C09J183/04

Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

Abstract translation: 接合方法包括将包括热固性树脂的接合材料施加到构件的工艺。 接合材料包括加成型有机硅树脂。 接合材料包括从由甲基的有机硅树脂，苯基类有机硅树脂和改性的有机硅树脂组成的组中选择的一种或多种。