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    SPECTROSCOPIC SENSOR AND METHOD FOR MANUFACTURING SAME
    1.
    发明申请
    SPECTROSCOPIC SENSOR AND METHOD FOR MANUFACTURING SAME 有权
    光谱传感器及其制造方法

    公开(公告)号：US20140295610A1

    公开(公告)日：2014-10-02

    申请号：US14219477

    申请日：2014-03-19

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Noriyuki NAKAMURA ,  Terunao HANAOKA ,  Kunihiko YANO

    IPC: H01L31/0232 ,  H01L31/18

    CPC classification number: H01L31/02165 ,  A61B5/14552 ,  A61B2562/0238 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  H01L31/02024

    Abstract: A method for manufacturing a spectroscopic sensor includes: (a) forming a light receiving element on a semiconductor substrate; (b) forming an angle restricting filter on the semiconductor substrate; and (c) forming a spectroscopic filter on the angle restricting filter. The step (c) of forming a spectroscopic filter includes: (c1) forming a first light transmitting film having a peripheral edge that overlaps a light blocking portion in plan view ox the semiconductor substrate by a lift-off method; and (c2) forming a second light transmitting film at a position spaced apart from the first light transmitting film in plan view of the semiconductor substrate by the lift-off method, the second light transmitting film having a peripheral edge that overlaps the light blocking portion in plan view of the semiconductor substrate.

    Abstract translation: 一种分光传感器的制造方法，包括：（a）在半导体基板上形成受光元件; （b）在半导体衬底上形成角度限制滤光器; 和（c）在角度限制滤光片上形成光谱滤光器。 形成分光滤光器的步骤（c）包括：（c1）通过剥离方法形成具有与半导体衬底平面图中的遮光部分重叠的周缘的第一透光膜; 和（c2）通过剥离法在半导体衬底的俯视图中在与第一透光膜间隔开的位置处形成第二透光膜，第二透光膜具有与遮光部分重叠的周边边缘 在半导体衬底的平面图中。

    ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME
    3.
    发明申请
    ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME 有权
    电子元件及其制造方法

    公开(公告)号：US20160148871A1

    公开(公告)日：2016-05-26

    申请号：US14939384

    申请日：2015-11-12

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Terunao HANAOKA

    IPC: H01L23/528 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L23/29

    CPC classification number: H01L21/56 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/525 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An aspect of the invention is an electronic component including a semiconductor substrate 11 that has an electrode pad 12, a first resin layer 14 and a third resin layer 15 that are located above the semiconductor substrate, a second resin layer 16 that is formed such that at least portions of the second resin layer are located on the first resin layer and the third resin layer, a resin projection 17 that includes the first to third resin layers and is higher than the first resin layer, and a wiring layer 24 that is electrically connected to the electrode pad and lies above the resin projection.

    Abstract translation: 本发明的一个方面是一种电子部件，包括：半导体基板11，其具有位于半导体基板上方的电极焊盘12，第一树脂层14和第三树脂层15;第二树脂层16，其形成为： 第二树脂层的至少一部分位于第一树脂层和第三树脂层上，包括第一至第三树脂层并且高于第一树脂层的树脂突起17和电连接的布线层24 连接到电极焊盘并且位于树脂突起的上方。

    ELECTRO-OPTICAL DEVICE, METHOD OF MANUFACTURING ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS
    5.
    发明申请
    ELECTRO-OPTICAL DEVICE, METHOD OF MANUFACTURING ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS 有权
    电光装置，制造电光装置的方法和电子装置

    公开(公告)号：US20160282610A1

    公开(公告)日：2016-09-29

    申请号：US15017746

    申请日：2016-02-08

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Terunao HANAOKA

    IPC: G02B26/08

    CPC classification number: G03B21/16 ,  B81B3/00 ,  G02B26/0833 ,  G02B26/0841 ,  G03B21/008

    Abstract: In an electro-optical device, a light-transmitting cover is disposed in mirrors, and when light is applied toward the mirrors through the light-transmitting cover, the temperature of the light-transmitting cover tires to increase due to the applied light. Here, in the electro-optical device, first metal portions that are in contact with the light-transmitting cover and the element substrate are formed. For this reason, it is possible to release the heat of the light-transmitting cover to a substrate through the first metal portions and the element substrate.

    Abstract translation: 在电光装置中，透光盖设置在反射镜中，并且当通过透光盖向反射镜施加光时，透光罩轮胎的温度由于所施加的光而增加。 这里，在电光装置中，形成与透光罩和元件基板接触的第一金属部。 因此，可以通过第一金属部分和元件基板将透光盖的热量释放到基板。

    ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
    6.
    发明申请
    ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS 有权
    电光装置及其制造方法和电子装置

    公开(公告)号：US20160282606A1

    公开(公告)日：2016-09-29

    申请号：US15017101

    申请日：2016-02-05

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Suguru UCHIYAMA ,  Terunao HANAOKA

    IPC: G02B26/08

    CPC classification number: G02B26/0841 ,  B81B2201/042 ,  B81C1/00317 ,  B81C2203/0118 ,  G02B26/0833

    Abstract: In an electro-optical device, a mirror and the like which is formed on an element substrate is sealed using a sealing member. The sealing member is provided with a frame section and a coyer section. In addition, the sealing member is provided on one face of the element substrate so that the mirror is surrounded by the element substrate and the sealing member and such that the mirror is positioned between a portion of the cover section and the element substrate. The sealing member is formed of a light-transmitting member having a frame section and a cover section which are integrally formed, and there is no interface between the frame section and the cover section.

    Abstract translation: 在电光装置中，使用密封构件密封形成在元件基板上的反射镜等。 密封构件设置有框架部分和梳齿部分。 此外，密封构件设置在元件基板的一个面上，使得反射镜被元件基板和密封构件包围，并且使得反射镜位于盖部分的一部分和元件基板之间。 密封构件由具有框架部分和盖部分的一体形成的透光构件形成，并且框架部分和盖部分之间没有界面。

    ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
    7.
    发明申请
    ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS 审中-公开
    电光装置及其制造方法和电子装置

    公开(公告)号：US20160282609A1

    公开(公告)日：2016-09-29

    申请号：US15040725

    申请日：2016-02-10

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Terunao HANAOKA ,  Shuhei YAMADA

    IPC: G02B26/08

    CPC classification number: G02B26/0833 ,  G02B26/0841

    Abstract: In an electro-optical device, a mirror that is formed on an element substrate is sealed by a frame shaped spacer and a plate-like light-transmitting cover which is adhered to the spacer. An inorganic barrier layer is formed on an outer face of the spacer and a side face of the light-transmitting cover, and the boundary of the spacer and the light-transmitting cover is covered by the inorganic barrier layer.

    Abstract translation: 在电光装置中，形成在元件基板上的反射镜由框状的间隔件和粘贴在间隔件上的板状透光罩密封。 在隔离物的外表面和透光罩的侧面上形成无机阻挡层，间隔物和透光罩的边界被无机阻挡层覆盖。

    SENSOR DEVICE, MOTION SENSOR, AND ELECTRONIC DEVICE
    8.
    发明申请
    SENSOR DEVICE, MOTION SENSOR, AND ELECTRONIC DEVICE 审中-公开
    传感器装置，运动传感器和电子装置

    公开(公告)号：US20140103467A1

    公开(公告)日：2014-04-17

    申请号：US14107562

    申请日：2013-12-16

    Applicant: Seiko Epson Corporation

    Inventor： Seiichi CHIBA ,  Shuji KOJIMA ,  Toshiyuki ENTA ,  Akinori SHINDO ,  Terunao HANAOKA ,  Yasuo YAMASAKI

    IPC: G01P15/097 ,  B81B7/00

    CPC classification number: G01P15/097 ,  B81B7/0006 ,  G01C19/5783 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A sensor device includes a first electrode disposed on active surface side of a silicon substrate, an external connecting terminal electrically connected to the first electrode, at least one stress relaxation layer disposed between the silicon substrate and the external connecting terminal, a connecting terminal disposed on the active surface side of the silicon substrate, and a vibration gyro element having weight sections as mass adjustment sections, the vibration gyro element is held by the silicon substrate due to connection between the connection electrode and the external connecting terminal, and a meltage protection layer formed in an area where the stress relaxation layer and the mass adjustment section overlap each other in a plan view is provided.

    Abstract translation: 传感器装置包括设置在硅衬底的有源表面侧的第一电极，与第一电极电连接的外部连接端子，设置在硅衬底和外部连接端子之间的至少一个应力松弛层， 硅衬底的有源表面侧和具有作为质量调节部分的重量部分的振动陀螺元件，由于连接电极和外部连接端子之间的连接，振动陀螺元件由硅衬底保持，并且熔融保护层 形成在应力松弛层和质量调节部在平面图中彼此重叠的区域中。

    VIBRATION DEVICE AND METHOD FOR MANUFACTURING VIBRATION DEVICE
    9.
    发明申请
    VIBRATION DEVICE AND METHOD FOR MANUFACTURING VIBRATION DEVICE 审中-公开
    振动装置及制造振动装置的方法

    公开(公告)号：US20130255387A1

    公开(公告)日：2013-10-03

    申请号：US13849841

    申请日：2013-03-25

    Applicant: SEIKO EPSON CORPORATION

    Inventor： Terunao HANAOKA

    IPC: G01H17/00

    CPC classification number: G01H17/00 ,  G01C19/5621 ,  G01C19/5628 ,  Y10T29/49004

    Abstract: A vibration device includes: a semiconductor substrate; a first electrode provided on a first surface of the semiconductor substrate; a protective layer provided on the first surface and covering an end section of the first surface; and a vibration element having a vibration section, a mass adjusting section located on the vibration section and a second electrode. The vibration element is mounted on the first surface with the first electrode and the second electrode connected together, in a manner that the mass adjusting section is located in an area that overlaps the protective layer in a plan view, and a part of the vibration element is disposed at a position that does not overlap the first surface in a plan view.

    Abstract translation: 振动装置包括：半导体基板; 设置在所述半导体衬底的第一表面上的第一电极; 保护层，设置在第一表面上并覆盖第一表面的端部; 以及具有振动部分的振动元件，位于振动部分上的质量调节部分和第二电极。 所述振动元件安装在所述第一表面上，所述第一电极和所述第二电极连接在一起，使得所述质量调节部分位于与所述保护层在俯视图中重叠的区域中，并且所述振动元件的一部分 被布置在平面图中不与第一表面重叠的位置。

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