公开(公告)号：US20210371660A1

公开(公告)日：2021-12-02

申请号：US17290382

申请日：2019-11-05

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Keita ISHIDA ,  Gaku KITADA

IPC: C08L83/04 ,  C09K5/14 ,  C08K3/20

Abstract: There is provided a heat-conducting composition capable of forming thick films in good productivity. The heat-conducting composition contains a binder and a heat-conducting filler, wherein a first viscosity thereof is 50 to 300 Pa·s as measured at a rotating speed of 10 rpm at 25° C. by using a rotational viscometer; and the ratio [second viscosity/first viscosity] of a second viscosity to the first viscosity is 3 to 8 where the second viscosity is a viscosity measured at a rotating speed of 1 rpm at 25° C. by using the rotational viscometer.

公开(公告)号：US20240250333A1

公开(公告)日：2024-07-25

申请号：US18282650

申请日：2022-03-25

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Tatsuya IWAMOTO ,  Gaku KITADA ,  Toshiki KANEKO ,  Daichi SATO

IPC: H01M10/653 ,  C09K5/14 ,  H01M10/6551

CPC classification number: H01M10/653 ,  C09K5/14 ,  H01M10/6551

Abstract: The present invention provides a thermally conductive composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a reaction rate controlling agent, wherein in measurement using a viscoelasticity measuring apparatus under conditions of 35° C., a shear mode, a frequency of 1 Hz, and a strain of 10%, a storage modulus G′1 after 3,600 seconds from the start of the measurement is 2,000 Pa or less, and a storage modulus G′2 after 7,200 seconds from the start of the measurement is 4,350 Pa or more, and wherein viscosity measured at 25° C. and a shear rate of 10 rpm is 220 Pa·s or less. According to the present invention, it is possible to provide the thermally conductive composition that has good workability and maintains reliability as a product, over a relatively wide temperature range.

公开(公告)号：US20240132766A1

公开(公告)日：2024-04-25

申请号：US18273131

申请日：2022-01-20

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Tatsuya IWAMOTO ,  Gaku KITADA

IPC: C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  H01M10/653 ,  H01M50/211

CPC classification number: C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  H01M10/653 ,  H01M50/211 ,  C08K2003/2227 ,  C08K2201/001

Abstract: The present invention provides a thermally conductive composition comprising: (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a polysiloxane compound containing at least one alkyl group having 4 or more carbon atoms. According to the present invention, it is possible to provide the thermally conductive composition capable of forming a thermally conductive member having an excellent thermally conductive property and high adhesive force to polypropylene.

公开(公告)号：US20200291283A1

公开(公告)日：2020-09-17

申请号：US16768193

申请日：2018-12-03

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Gaku KITADA ,  Keita ISHIDA

IPC: C09K5/14 ,  C08K3/22 ,  C08K3/08

Abstract: The thermally conductive composition comprises a thermally conductive filler dispersed in a liquid matrix.

公开(公告)号：US20240400878A1

公开(公告)日：2024-12-05

申请号：US18692582

申请日：2022-09-28

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Gaku KITADA

IPC: C09K5/14 ,  C09K5/10 ,  H01M10/653 ,  H01M50/204

Abstract: A thermally conductive composition of the present invention is a composition in a liquid form at 25° C. comprising an organopolysiloxane, a thermally conductive filler, and an ester compound having 12 to 28 carbon atoms. According to the present invention, it is possible to provide a thermally conductive composition, which has good workability because of its low viscosity, excellent heat resistance, and in which a low-molecular weight siloxane does not tend to be generated.

公开(公告)号：US20240021909A1

公开(公告)日：2024-01-18

申请号：US18267303

申请日：2021-12-17

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Gaku KITADA

IPC: H01M10/653 ,  H01M50/211 ,  C09K5/14 ,  C08K3/22

CPC classification number: H01M10/653 ,  H01M50/211 ,  C09K5/14 ,  C08K3/22 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2003/2227

Abstract: The present invention relates to a battery module comprising a case, a plurality of cells arranged in the case, and a heat absorbing member disposed at least either between the case and the cell or between the plurality of cells, wherein the heat absorbing member comprises a silicone matrix and a small particle size aluminum hydroxide having a particle size of 5 μm or less dispersed in the silicone matrix, wherein a content of the small particle size aluminum hydroxide is 20 vol % or more. According to the present investigation, a battery module capable of absorbing a generated heat at 300° C. or less for a long period of time can be provided.

公开(公告)号：US20220238939A1

公开(公告)日：2022-07-28

申请号：US17615703

申请日：2020-06-05

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Motoki OZAWA ,  Gaku KITADA

IPC: H01M10/6555 ,  H01M10/613 ,  H01M10/651 ,  H01M10/659

Abstract: The present invention is a battery module comprising a case, a plurality of cells being arranged in the case and having an energy density of 200 Wh/L or more, and a heat absorbing member provided at least either between the case and the plurality of cells or between the plurality of cells, wherein the heat absorbing member has an endothermic quantity Q from 150° C. to 350° C. of 500 J/cm3 or more and a thermal conductivity λ of 0.8 W/mK or more.
According to the present invention, there can be provided a battery module whose temperature hardly rises in an abnormal early period and in a certain period from abnormality occurrence.