公开(公告)号：US20240132766A1

公开(公告)日：2024-04-25

申请号：US18273131

申请日：2022-01-20

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Tatsuya IWAMOTO ,  Gaku KITADA

IPC: C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  H01M10/653 ,  H01M50/211

CPC classification number: C09K5/14 ,  C08G77/12 ,  C08G77/20 ,  C08K3/22 ,  H01M10/653 ,  H01M50/211 ,  C08K2003/2227 ,  C08K2201/001

Abstract: The present invention provides a thermally conductive composition comprising: (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a polysiloxane compound containing at least one alkyl group having 4 or more carbon atoms. According to the present invention, it is possible to provide the thermally conductive composition capable of forming a thermally conductive member having an excellent thermally conductive property and high adhesive force to polypropylene.

公开(公告)号：US20240279471A1

公开(公告)日：2024-08-22

申请号：US18562480

申请日：2022-07-28

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Tatsuya IWAMOTO ,  Toshiki KANEKO ,  Hiroshi UMETANI

IPC: C08L83/06 ,  C08K3/22

CPC classification number: C08L83/06 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/001 ,  C08L2205/02

Abstract: A thermally conductive composition of the present invention comprises a silicone base material, a viscosity reducing agent, and a thermally conductive filler, wherein a ratio between a weight-average molecular weight Mw1 of the silicone base material and a weight-average molecular weight Mw2 of the viscosity reducing agent (Mw1/Mw2) is 0.5 or more and 8.5 or less. The present invention can provide a thermally conductive composition comprising a silicone base material, a viscosity reducing agent, and a thermally conductive filler, which has a high effect of reducing viscosity.

公开(公告)号：US20240250333A1

公开(公告)日：2024-07-25

申请号：US18282650

申请日：2022-03-25

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Tatsuya IWAMOTO ,  Gaku KITADA ,  Toshiki KANEKO ,  Daichi SATO

IPC: H01M10/653 ,  C09K5/14 ,  H01M10/6551

CPC classification number: H01M10/653 ,  C09K5/14 ,  H01M10/6551

Abstract: The present invention provides a thermally conductive composition comprising (A) an organopolysiloxane containing at least two alkenyl groups, (B) a hydrogenorganopolysiloxane containing at least two hydrosilyl groups, (C) a thermally conductive filler, and (D) a reaction rate controlling agent, wherein in measurement using a viscoelasticity measuring apparatus under conditions of 35° C., a shear mode, a frequency of 1 Hz, and a strain of 10%, a storage modulus G′1 after 3,600 seconds from the start of the measurement is 2,000 Pa or less, and a storage modulus G′2 after 7,200 seconds from the start of the measurement is 4,350 Pa or more, and wherein viscosity measured at 25° C. and a shear rate of 10 rpm is 220 Pa·s or less. According to the present invention, it is possible to provide the thermally conductive composition that has good workability and maintains reliability as a product, over a relatively wide temperature range.