公开(公告)号：US11915905B2

公开(公告)日：2024-02-27

申请号：US16918299

申请日：2020-07-01

Applicant: SEMES CO., LTD.

Inventor： Hyoungkyu Son ,  Yu Dong Han ,  Hyeon Gyu Kim ,  Seon Ok Kim

IPC: H01J37/32 ,  H01L21/683 ,  H01J37/20

CPC classification number: H01J37/20 ,  H01J37/32082 ,  H01J37/32532 ,  H01J37/32715 ,  H01L21/683 ,  H01J2237/334

Abstract: A support unit provided in an apparatus for treating a substrate using plasma includes a dielectric plate on which the substrate is placed, an electrode plate disposed under the dielectric plate, a power supply rod that applies power to the electrode plate, and a flange that has a shape surrounding the power supply rod and that is spaced apart from the power supply rod.

公开(公告)号：US20220199368A1

公开(公告)日：2022-06-23

申请号：US17545130

申请日：2021-12-08

Applicant: SEMES CO., LTD.

Inventor： Hyoungkyu Son ,  Jong-Hwan An ,  Jae Hyun Cho ,  Min Keun Bae ,  Ogsen Galstyan ,  Dong Suk Kim ,  Hyeon Gyu Kim ,  Won Seok Lee ,  Sung Je Kim

IPC: H01J37/32

Abstract: Provided is a support unit included in an apparatus for treating a substrate using plasma and configured to support the substrate. The support unit may include a power supply rod connected to a high-frequency power supply; an electrode plate configured to receive power from the power supply rod; and a ground ring provided to surround the electrode plate when viewed from the top and including a ground ring to be grounded.

公开(公告)号：US12249491B2

公开(公告)日：2025-03-11

申请号：US17395860

申请日：2021-08-06

Applicant: SEMES CO., LTD.

Inventor： Hyoungkyu Son ,  Jong-Hwan An ,  Jae Hyun Cho ,  Min Keun Bae ,  Dong Suk Kim ,  Hyeon Gyu Kim ,  Ogsen Galstyan ,  Won Seok Lee ,  Sung Je Kim

IPC: H01J37/32 ,  H01L21/3065

Abstract: The inventive concept relates to a substrate support unit provided in an apparatus for treating a substrate using plasma. In an embodiment, the substrate support unit includes a dielectric plate on which the substrate is placed, a lower electrode that is disposed under the dielectric plate and that has a first diameter, a power supply rod that applies RF power to the lower electrode and has a second diameter, and a ground member disposed under the lower electrode and spaced apart from the lower electrode by a first gap by an insulating member, the ground member including a plate portion having a through-hole formed therein through which the power supply rod passes, in which the through-hole has a third diameter.

公开(公告)号：US20210005424A1

公开(公告)日：2021-01-07

申请号：US16914860

申请日：2020-06-29

Applicant: SEMES CO., LTD.

Inventor： Hyoungkyu Son ,  Hyeon Gyu Kim ,  Seon Ok Kim ,  Yu Dong Han

IPC: H01J37/32 ,  B05B1/18 ,  B05B1/24 ,  H01L21/67 ,  H01L21/683

Abstract: Provided is a shower head unit for control temperature for each area using a planar heating element and a substrate treating system having the same. The substrate treating system includes a housing, a shower head unit installed on an inner upper side of the housing and for entering a process gas for etching a substrate into the housing, and an electrostatic chuck installed on an inner lower side of the housing and for seating the substrate, wherein the shower head unit is installed as a planar heating element in a plurality of areas to control temperature for each area.