公开(公告)号：US11984388B2

公开(公告)日：2024-05-14

申请号：US18330133

申请日：2023-06-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Stephen St. Germain ,  Jay A. Yoder ,  Dennis Lee Conner ,  Frank Robert Cervantes ,  Andrew Celaya

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L23/49805 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/181

Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

公开(公告)号：US11107753B2

公开(公告)日：2021-08-31

申请号：US16203072

申请日：2018-11-28

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Stephen St. Germain ,  Roger Arbuthnot ,  David Billings ,  Andrew Celaya

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/64 ,  H01L21/56 ,  H01L23/31 ,  H01L29/20

Abstract: Implementations of semiconductor packages may include: a substrate having one or more traces on a first side and one or more traces on a second side of the substrate. The substrate may be rigid. The packages may include at least one die mechanically and electrically coupled to the first side of the substrate. The die may be a high voltage die. The package may include one or more traces along one or more edges of the substrate. The one or more traces along the one or more edges of the substrate provide electrical connectivity between the one or more traces on the first side of the substrate and the one or more traces on the second side of the substrate. The package may also include a molding compound encapsulating at least the first and the one or more edges of the ceramic substrate.

公开(公告)号：US11710686B2

公开(公告)日：2023-07-25

申请号：US17457148

申请日：2021-12-01

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Stephen St. Germain ,  Jay A. Yoder ,  Dennis Lee Conner ,  Frank Robert Cervantes ,  Andrew Celaya

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49805 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/181

Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

公开(公告)号：US20220084920A1

公开(公告)日：2022-03-17

申请号：US17457148

申请日：2021-12-01

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Stephen ST. GERMAIN ,  Jay A. YODER ,  Dennis Lee CONNER ,  Frank Robert CERVANTES ,  Andrew Celaya

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

公开(公告)号：US11217515B2

公开(公告)日：2022-01-04

申请号：US16554980

申请日：2019-08-29

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Stephen St. Germain ,  Jay A. Yoder ,  Dennis Lee Conner ,  Frank Robert Cervantes ,  Andrew Celaya

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

公开(公告)号：US20190385939A1

公开(公告)日：2019-12-19

申请号：US16554980

申请日：2019-08-29

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Stephen ST. GERMAIN ,  Jay A. YODER ,  Dennis Lee CONNER ,  Frank Robert CERVANTES ,  Andrew Celaya

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.