公开(公告)号：US20240395662A1

公开(公告)日：2024-11-28

申请号：US18324362

申请日：2023-05-26

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Ingoo KANG ,  Oseob JEON ,  Seungwon IM

IPC: H01L23/473 ,  H01L21/48 ,  H01L25/07

Abstract: A package includes a semiconductor die disposed on a three-layer substrate. The three-layer substrate includes a ceramic layer disposed between a top metal layer and a bottom metal layer. The semiconductor die is disposed on the top metal layer. An array of mesas is defined in the bottom metal layer with grooves between the mesas forming a path for cooling fluid flow across a surface of the bottom metal layer.