公开(公告)号：US11209353B2

公开(公告)日：2021-12-28

申请号：US16651230

申请日：2018-09-28

Applicant: SENSIRION AG

Inventor： Nicolas Zäch ,  Martin Winger ,  Nicolas Daix ,  Sebastian Raab ,  Thomas Uehlinger

IPC: G01N21/35 ,  G01N21/3504 ,  G01J3/10 ,  G01J5/08

Abstract: An infrared device comprises a substrate. A configuration for emitting infrared radiation is supported by the substrate. The configuration comprises an electrically conducting layer arrangement of less than 50 nm thickness between dielectric layers. In addition, a heater arranged for heating the configuration to emit the infrared radiation is supported by the substrate.