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Patent Agency Ranking
公开(公告)号：US09506885B2
公开(公告)日：2016-11-29
申请号：US14850031
申请日：2015-09-10
Applicant: Sensirion AG
Inventor： Felix Mayer , Ulrich Bartsch , Martin Winger , Markus Graf , Pascal Gerner
CPC classification number: G01N27/048 , G01N27/128 , G01N27/14 , G01N27/225 , G01N33/0036 , H01L2224/18
Abstract: A sensor chip comprises a substrate (1) with a front side (11) and a back side (12), and an opening (13) in the substrate (1) reaching through from its back side (12) to its front side (11). A stack (2) of dielectric and conducting layers is arranged on the front side (11) of the substrate (1), a portion of which stack (2) spans the opening (13) of the substrate (1). Contact pads (32) are arranged at the front side (11) of the substrate (1) for electrically contacting the sensor chip. A sensing element (4) is arranged on the portion of the stack (2) spanning the opening (13) on a side of the portion facing the opening (13).
Abstract translation: 传感器芯片包括具有前侧（11）和后侧（12）的基板（1）和基板（1）中的从其后侧（12）到其前侧（12）到达的开口（13） 11）。 介电层和导电层的叠层（2）布置在基板（1）的前侧（11）上，其一部分堆叠（2）跨越基板（1）的开口（13）。 接触焊盘（32）布置在基板（1）的前侧（11）处，用于电接触传感器芯片。 感测元件（4）布置在跨过开口（13）的面向开口（13）的一侧的堆叠（2）的部分上。
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公开(公告)号：US11209353B2
公开(公告)日：2021-12-28
申请号：US16651230
申请日：2018-09-28
Applicant: SENSIRION AG
Inventor： Nicolas Zäch , Martin Winger , Nicolas Daix , Sebastian Raab , Thomas Uehlinger
IPC: G01N21/35 , G01N21/3504 , G01J3/10 , G01J5/08
Abstract: An infrared device comprises a substrate. A configuration for emitting infrared radiation is supported by the substrate. The configuration comprises an electrically conducting layer arrangement of less than 50 nm thickness between dielectric layers. In addition, a heater arranged for heating the configuration to emit the infrared radiation is supported by the substrate.
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公开(公告)号：US10928312B2
公开(公告)日：2021-02-23
申请号：US15815885
申请日：2017-11-17
Applicant: Sensirion AG
Inventor： Martin Winger , Christophe Salzmann , Fabian Weller
IPC: G01N21/3504 , H05K1/18 , G01N21/03 , G01N21/01
Abstract: A gas sensor module integrated onto a board comprising at least one radiation source configured for emitting radiation, at least one radiation detector unit configured to detect at least part of said radiation, and a radiation cell providing at least one radiation path from said radiation source to said radiation detector unit. Said board is provided with a recess and said radiation path is propagating within said recess.
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公开(公告)号：US10444076B2
公开(公告)日：2019-10-15
申请号：US15778753
申请日：2015-11-26
Applicant: Sensirion AG
Inventor： Martin Winger , Marc Von Waldkirch , Matthias Streiff , Alexander Lochbaum , Jürg Leuthold
Abstract: An infrared device comprises a substrate (1), and arranged on or in the substrate (1) a configuration (3) for one of selectively emitting and selectively absorbing infrared radiation of a band, the configuration (3) comprising a pattern made from an electrically conducting material on a first level (L1), an electrically conducting film (33) on a second level (L2), and a dielectric layer (24) between the pattern and the film (33). One or more of a heater (4) for heating the configuration (3), and a thermal sensor (5) arranged for sensing the selective infrared radiation of the band absorbed by the configuration (3) on or in the substrate.
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公开(公告)号：US20180143129A1
公开(公告)日：2018-05-24
申请号：US15815885
申请日：2017-11-17
Applicant: Sensirion AG
Inventor： Martin Winger , Christophe Salzmann , Fabian Weller
IPC: G01N21/3504 , G01N21/03
CPC classification number: G01N21/3504 , G01N21/0303 , G01N2021/0106 , G01N2201/0636
Abstract: A gas sensor module integrated onto a board comprising at least one radiation source configured for emitting radiation, at least one radiation detector unit configured to detect at least part of said radiation, and a radiation cell providing at least one radiation path from said radiation source to said radiation detector unit. Said board is provided with a recess and said radiation path is propagating within said recess.
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