Sensor chip
    1.
    发明授权
    Sensor chip 有权
    传感器芯片

    公开(公告)号:US09506885B2

    公开(公告)日:2016-11-29

    申请号:US14850031

    申请日:2015-09-10

    Applicant: Sensirion AG

    Abstract: A sensor chip comprises a substrate (1) with a front side (11) and a back side (12), and an opening (13) in the substrate (1) reaching through from its back side (12) to its front side (11). A stack (2) of dielectric and conducting layers is arranged on the front side (11) of the substrate (1), a portion of which stack (2) spans the opening (13) of the substrate (1). Contact pads (32) are arranged at the front side (11) of the substrate (1) for electrically contacting the sensor chip. A sensing element (4) is arranged on the portion of the stack (2) spanning the opening (13) on a side of the portion facing the opening (13).

    Abstract translation: 传感器芯片包括具有前侧(11)和后侧(12)的基板(1)和基板(1)中的从其后侧(12)到其前侧(12)到达的开口(13) 11)。 介电层和导电层的叠层(2)布置在基板(1)的前侧(11)上,其一部分堆叠(2)跨越基板(1)的开口(13)。 接触焊盘(32)布置在基板(1)的前侧(11)处,用于电接触传感器芯片。 感测元件(4)布置在跨过开口(13)的面向开口(13)的一侧的堆叠(2)的部分上。

    Gas sensor module
    3.
    发明授权

    公开(公告)号:US10928312B2

    公开(公告)日:2021-02-23

    申请号:US15815885

    申请日:2017-11-17

    Applicant: Sensirion AG

    Abstract: A gas sensor module integrated onto a board comprising at least one radiation source configured for emitting radiation, at least one radiation detector unit configured to detect at least part of said radiation, and a radiation cell providing at least one radiation path from said radiation source to said radiation detector unit. Said board is provided with a recess and said radiation path is propagating within said recess.

    Infrared device
    4.
    发明授权

    公开(公告)号:US10444076B2

    公开(公告)日:2019-10-15

    申请号:US15778753

    申请日:2015-11-26

    Applicant: Sensirion AG

    Abstract: An infrared device comprises a substrate (1), and arranged on or in the substrate (1) a configuration (3) for one of selectively emitting and selectively absorbing infrared radiation of a band, the configuration (3) comprising a pattern made from an electrically conducting material on a first level (L1), an electrically conducting film (33) on a second level (L2), and a dielectric layer (24) between the pattern and the film (33). One or more of a heater (4) for heating the configuration (3), and a thermal sensor (5) arranged for sensing the selective infrared radiation of the band absorbed by the configuration (3) on or in the substrate.

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