Abstract:
A plasma processing device capable of plasma shaping through magnetic field control includes: a vacuum chamber having an inner space on which a substrate is mounted; an antenna positioned on the upper portion of the chamber and generating plasma in the inner space of the chamber; a magnetic field generation unit including a first magnetic field generation unit disposed on the lower portion of the chamber and including one or more electromagnetic coils and a second magnetic field generation unit including one or more electromagnetic coils disposed on the side of the chamber; and a control unit controlling current input into the electromagnetic coils of the magnetic field generation unit.
Abstract:
A plasma processing device capable of plasma shaping through magnetic field control includes: a vacuum chamber having an inner space on which a substrate is mounted; an antenna positioned on the upper portion of the chamber and generating plasma in the inner space of the chamber; a magnetic field generation unit including a first magnetic field generation unit disposed on the lower portion of the chamber and including one or more electromagnetic coils and a second magnetic field generation unit including one or more electromagnetic coils disposed on the side of the chamber; and a control unit controlling current input into the electromagnetic coils of the magnetic field generation unit.