公开(公告)号：US20230202126A1

公开(公告)日：2023-06-29

申请号：US17980053

申请日：2022-11-03

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Wei LIANG ,  Songgang CHAI ,  Qianfa LIU ,  Liangpeng HAO

IPC: B29C70/50 ,  B29C70/88 ,  B29C70/54 ,  C08J5/24

CPC classification number: B29C70/50 ,  B29C70/88 ,  B29C70/54 ,  C08J5/249 ,  C08J5/244 ,  B29K2105/089

Abstract: Provided are a low dielectric loss non-woven fabric, a preparation method thereof and use thereof. The low dielectric loss non-woven fabric is composed of an inorganic fiber and a binder, and the binder is any one or a combination of at least two of a fluorine-containing resin emulsion, a polyolefin emulsion, a polyphenylene ether resin or a cyanate ester resin. The non-woven fabric of the present application has good dielectric properties and obvious strengthening effect, and can meet various performance requirements for copper clad laminate materials in the field of high-frequency communication.

公开(公告)号：US20230192972A1

公开(公告)日：2023-06-22

申请号：US17766440

申请日：2020-12-17

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Songgang CHAI ,  Qianfa LIU ,  Liangpeng HAO ,  Wei LIANG

IPC: C08J5/18 ,  C08L27/18 ,  C08K7/18 ,  C08K9/06 ,  H05K1/03

CPC classification number: C08J5/18 ,  C08L27/18 ,  C08K7/18 ,  C08K9/06 ,  H05K1/0373 ,  C08L2201/52 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03 ,  C08J2327/18 ,  C08J2471/02 ,  C08J2427/18 ,  C08K2201/005 ,  H05K2201/0209

Abstract: The present invention relates to a fluorine-containing resin composition, and a resin vanish, a fluorine-containing dielectric sheet, a laminate, a copper clad laminate and a printed circuit board containing the same. The fluorine-containing resin composition comprises 30 wt. %-70 wt. % of a fluorine-containing polymer, 30 wt. %-70 wt. % of an inorganic filler which includes the following particle size distribution: D10 is greater than 1.5 μm; and D50 is 10-15 μm. In the present invention, the selection of an inorganic filler with a specific particle size distribution can ensure that the boards prepared by the fluorine-containing resin composition have excellent dielectric properties and voltage resistance performance, even if the inorganic filler is added in a large amount.

公开(公告)号：US20160229990A1

公开(公告)日：2016-08-11

申请号：US15028578

申请日：2013-10-11

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cuiming DU ,  Liangpeng HAO ,  Songgang CHAI

IPC: C08K5/5398 ,  C08K5/05 ,  H05K1/03 ,  C08K3/22 ,  C08L63/00 ,  C08G59/06 ,  C08K5/39 ,  C08K3/36

CPC classification number: C08K5/5398 ,  B32B7/10 ,  B32B15/08 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/02 ,  B32B2264/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/12 ,  B32B2307/30 ,  B32B2457/08 ,  C08G59/063 ,  C08G59/245 ,  C08G59/40 ,  C08G59/4021 ,  C08G59/686 ,  C08G77/12 ,  C08G77/20 ,  C08J5/10 ,  C08J5/24 ,  C08J2300/24 ,  C08J2363/00 ,  C08J2483/04 ,  C08K3/22 ,  C08K3/36 ,  C08K5/05 ,  C08K5/39 ,  C08K2003/2227 ,  C08L61/04 ,  C08L63/00 ,  C08L83/04 ,  C08L2203/20 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0162 ,  H05K2201/0206 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/121 ,  C08K5/56 ,  C08K5/3445

Abstract: A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.

Abstract translation: 公开了一种包含热固性树脂，无机填料和有机钼化合物的热固性树脂组合物。 热固性树脂组合物可用于制备树脂消泡剂和预浸料坯，其中预浸料用于层压板和印刷电路板。