公开(公告)号：US11711893B2

公开(公告)日：2023-07-25

申请号：US17477534

申请日：2021-09-17

Applicant: SHENNAN CIRCUITS CO., LTD.

Inventor： Lixiang Huang ,  Jin Dong ,  Hua Miao

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/185 ,  H05K1/115 ,  H05K1/181

Abstract: The present disclosure relates to an electronic component, a voltage regulation module and a voltage stabilizer. The electronic component may include a substrate, a first electronic element and a second electronic element. The substrate may be provided with a first surface and a second surface that are opposite to each other. The first electronic element may be embedded in the substrate, and may be provided with a first electrical connection terminal and a second electrical connection terminal. The first electrical connection terminal may connect with a first surface of the substrate, the second electrical connection terminal may connect with a second surface of the substrate. The second electronic element may be arranged on the second surface of the substrate and electrically connected to the second electrical connection terminal. The second electronic element may form a stack with the substrate along the first direction.

公开(公告)号：US11737212B2

公开(公告)日：2023-08-22

申请号：US17565470

申请日：2021-12-30

Applicant: SHENNAN CIRCUITS CO., LTD.

Inventor： Lixiang Huang ,  Hua Miao ,  Jin Dong

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/041

Abstract: Disclosed are an electronic component package, an electronic assembly, and a voltage regulation module. The electronic component package includes a substrate and a first electronic component. The substrate includes a first surface and a second surface; wherein the first surface is arranged with a first conductive layer, and the second surface is arranged with a second conductive layer. The substrate defines a first conductive hole connected to the first conductive layer and a second conductive hole connected to the second conductive layer. The first electronic component is received in the substrate and arranged with a first electrical connection terminal and a second electrical connection terminal; the first electrical connection terminal is connected to the first conductive layer through the first conductive hole, and the second electrical connection terminal is connected to the second conductive layer through the second conductive hole. The first electronic component is a passive electronic component.