公开(公告)号：US20230274951A1

公开(公告)日：2023-08-31

申请号：US18015073

申请日：2020-08-05

Applicant: SHINKAWA LTD.

Inventor： Yuichiro NOGUCHI ,  Alexander DZHANGIROV ,  Kohei SEYAMA

IPC: H01L21/603 ,  H01L21/52 ,  H01L23/00

CPC classification number: H01L21/603 ,  H01L21/52 ,  H01L24/08 ,  H01L24/24 ,  H01L24/73 ,  H01L2021/6015

Abstract: In this mounting device (10) for mounting a semiconductor chip (100) on a substrate (104), a controller (50) is provided with: a mounter for pressing the semiconductor chip (100) to the substrate (104) in a state where a cover film (110) is interposed between the semiconductor chip (100) and a thermocompression tool (16), and for heating and then cooling the thermocompression tool (16) to mount the semiconductor chip (100) on the substrate (104); and a separator for heating the thermocompression tool (16) after the semiconductor chip (100) has been mounted, and for raising a mounting head (17) to be separated from the cover film (110).

公开(公告)号：US20220415845A1

公开(公告)日：2022-12-29

申请号：US17642948

申请日：2020-07-16

Applicant: SHINKAWA LTD.

Inventor： Alexander DZHANGIROV ,  Kohei SEYAMA

IPC: H01L23/00

Abstract: The present invention provides a mounting apparatus, including a bonding stage holding a substrate on which a semiconductor chip is arranged; a base stand; a mounting head mounted with a pressing tool that presses the semiconductor chip on the substrate; and a film arranging mechanism provided on the base stand and moving a cover film along the bonding stage to arrange the cover film between the semiconductor chip pressed by the substrate and the pressing tool. The film arranging mechanism includes film guides guiding the cover film and defining a height with respect to the bonding stage; and lifting mechanisms connected to the film guides via springs and lifting and lowering the film guides with respect to the bonding stage.

公开(公告)号：US20220412733A1

公开(公告)日：2022-12-29

申请号：US17630515

申请日：2020-07-30

Applicant: SHINKAWA LTD.

Inventor： Yuichiro NOGUCHI ,  Alexander DZHANGIROV

IPC: G01B21/22 ,  G01B21/08

Abstract: The present invention provides a mounting apparatus and a parallelism detection method in the mounting apparatus. The parallelism detection method in the mounting apparatus includes: a first height detection process of detecting first heights of a mounting tool when a holding surface comes into contact with the a tip of a triangular pin by placing the triangular pin on a placement surface of a stage and lowering the mounting tool; a second height detection process of detecting second heights of the mounting tool when the tip of the triangular pin comes into contact with the placement surface by holding the triangular pin on the holding surface of the mounting tool and lowering the mounting tool; and a parallelism calculation process of calculating the parallelism between the placement surface of the stage and the holding surface of the mounting tool based on the first heights and the second heights.