MOUNTING HEAD
    1.
    发明公开
    MOUNTING HEAD 审中-公开

    公开(公告)号:US20240063170A1

    公开(公告)日:2024-02-22

    申请号:US18269949

    申请日:2020-12-28

    Applicant: SHINKAWA LTD.

    Abstract: A mounting head for bonding a chip to a bonding target includes: a mounting tool having a bottom surface which functions as a suction surface for sucking and holding the chip; a heater arranged on an upper surface of the mounting tool and heating the mounting tool; a cooling mechanism having a plurality of cooling channels which are independent of one another and guide a refrigerant respectively to a plurality of cooling areas set in the heater, and being capable of cooling the plurality of cooling areas independently of one another; and a controller controlling driving of the heater and the cooling mechanism. The controller independently controls a flow rate of the refrigerant flowing through the plurality of cooling channels so as to obtain a desired temperature distribution during heating of the heater.

    ELECTRIC CIRCUIT ABNORMALITY DETECTION DEVICE

    公开(公告)号:US20240175941A1

    公开(公告)日:2024-05-30

    申请号:US18016354

    申请日:2021-07-28

    Applicant: SHINKAWA LTD.

    CPC classification number: G01R31/58

    Abstract: An electric circuit abnormality detection device includes a pulse generator, a directional coupler, and a detection unit. The detection unit includes a reference reflected wave database and a calculation part. The reference reflected wave database stores waveform information of a reference reflected wave inputted from the directional coupler when a pulse signal is inputted to a reference electric circuit that has a same wiring pattern as a pulse heater and does not have an abnormality. The calculation part detects an abnormality in the pulse heater by comparing waveform information of a reflected wave inputted from the directional coupler when the pulse signal is inputted to the pulse heater, with waveform information of the reference reflected wave stored in the reference reflected wave database.

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