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公开(公告)号：US10374195B2
公开(公告)日：2019-08-06
申请号：US16024034
申请日：2018-06-29
Applicant: SHINWHA INTERTEK CORP
Inventor： Sung Chul Yoon , Cheol Heung Ahn , Hwi Yong Lee , Ji Woong Park , Dong Hyun Kim , Geoung Min Shin
IPC: H01L51/52
Abstract: An adhesive film and an organic electronic device including the same are provided. The adhesive film includes: a first bonding layer including a first bonding component layer, a moisture absorbent, and first core shell particles; and a second bonding layer disposed below the first bonding layer and including second core shell particles, which are formed of a different material from the first core shell particles, wherein each of the first core shell particles includes a first shell and a first core surrounded by the first shell and each of the second core shell particles includes a second shell and a second core surrounded by the second shell.
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公开(公告)号：US09961809B1
公开(公告)日：2018-05-01
申请号：US15671038
申请日：2017-08-07
Applicant: SHINWHA INTERTEK CORP
Inventor： Sung Chul Yoon , Cheol Heung Ahn , Dong Hyun Kim , Hak-Soo Kim , Su-Han Woo , Jin Go , Won Jae Choi , Dae-Bok Park
CPC classification number: H05K7/20963 , F28F13/00 , F28F13/18 , H01L23/36 , H01L23/3677 , H01L23/373 , H01L23/3735
Abstract: Provided are heat radiation sheet and method of manufacturing the same. The heat radiation sheet comprising: a first protective layer; a first adhesive member which is disposed on the first protective layer and has one or more through holes; a support member which is disposed on the first adhesive member and has one or more through holes; a second adhesive member which is disposed on the support member and has one or more through holes; a heat radiation member which is disposed on the second adhesive member and has one or more through holes; and a third adhesive member which is disposed on the heat radiation member and comprises a base portion contacting a first surface of the heat radiation member and protrusions protruding from the base portion and inserted into the through holes of the heat radiation member, the through holes of the second adhesive member, the through holes of the support member and the through holes of the first adhesive member, wherein the protrusions of the third adhesive member are at least partially coupled to the first protective layer.
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公开(公告)号：US12292588B2
公开(公告)日：2025-05-06
申请号：US17798887
申请日：2021-01-27
Applicant: SHINWHA INTERTEK CORP
Inventor： Cheol Heung Ahn , Do Hyoung Kim , Seok Min Kang , Ka Young Son , Min Tae Kim , Chang Min Han
Abstract: An optical sheet and a method for manufacturing the optical sheet are provided. The optical sheet comprises: a first substrate; a first resin layer disposed on one surface of the substrate; a second resin layer disposed on one surface of the first resin layer; and a third resin layer disposed on one surface of the second resin layer, wherein the first resin layer includes a first one-surface corrugated portion formed on one surface thereof and having a plurality of convex portions and concave portions, the second resin layer includes a second other-surface corrugated portion formed on the other surface thereof and having a pattern shape complementary to that of the first one-surface corrugated portion, the second resin layer includes a second one-surface corrugated portion formed on one surface thereof, having a plurality of convex portions and concave portions and having a surface roughness value greater than that of the first one-surface corrugated portion, and the third resin layer has a third other-surface corrugated portion formed on the other surface thereof and having a pattern shape complementary to that of the second one-surface corrugated portion.
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公开(公告)号：US20190006624A1
公开(公告)日：2019-01-03
申请号：US16024034
申请日：2018-06-29
Applicant: SHINWHA INTERTEK CORP
Inventor： Sung Chul Yoon , Cheol Heung Ahn , Hwi Yong Lee , Ji Woong Park , Dong Hyun Kim , Geoung Min Shin
IPC: H01L51/52
CPC classification number: H01L51/5259 , C08K9/02 , C08K2201/013 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2203/326 , C09J2205/102 , H01L51/5246
Abstract: An adhesive film and an organic electronic device including the same are provided. The adhesive film includes: a first bonding layer including a first bonding component layer, a moisture absorbent, and first core shell particles; and a second bonding layer disposed below the first bonding layer and including second core shell particles, which are formed of a different material from the first core shell particles, wherein each of the first core shell particles includes a first shell and a first core surrounded by the first shell and each of the second core shell particles includes a second shell and a second core surrounded by the second shell.
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