公开(公告)号：US20140042305A1

公开(公告)日：2014-02-13

申请号：US13953911

申请日：2013-07-30

Applicant: SIGURD MICROELECTRONICS CORP.

Inventor： CHIU-WEI LIU

IPC: G01V8/12

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention provides an optical package module, which comprises a substrate, a light emitting element, a first molding compound, a second molding compound, a light sensing element, and a cap. The light emitting element and the light sensing element are disposed on the substrate, and the first molding compound and the second molding compound are respectively molded upon the light sensing element and the light emitting element. The first molding compound comprises a first optical structure corresponding to the light sensing element, and the second molding compound comprises a second optical structure corresponding to the light emitting element. By designing the first and second optical structure of the optical package module, it achieves the purposes of improving light emitting and sensing efficiency of the present invention.

Abstract translation: 本发明提供一种光学封装模块，其包括基板，发光元件，第一模塑料，第二模塑料，光感测元件和盖。 发光元件和感光元件设置在基板上，并且第一模塑料和第二模塑料分别模制在光感测元件和发光元件上。 第一模塑料包括对应于感光元件的第一光学结构，第二模塑料包括对应于发光元件的第二光学结构。 通过设计光学封装模块的第一和第二光学结构，实现了提高本发明的发光和感测效率的目的。