公开(公告)号：US09831197B1

公开(公告)日：2017-11-28

申请号：US15422727

申请日：2017-02-02

Applicant: SIGURD MICROELECTRONICS CORP.

Inventor： Tsan-Lien Yeh ,  Kuan-Tien Shen ,  Szu-Chuan Pang ,  Wei-Ping Wang

IPC: H01L23/552 ,  H01L23/60 ,  H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L21/3205

CPC classification number: H01L21/32051 ,  H01L23/552 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/14515 ,  H01L2224/16227 ,  H01L2224/17515 ,  H01L2924/3025

Abstract: Provided is a wafer-level package with metal shielding structure and the manufacturing method for producing the same. The wafer-level package includes first conductive structures for securing a die unit to a substrate, and is featured by disposing one or more second conductive structures that are located at the front surface of the die unit and proximate to a side surface of the die unit. The second conductive structure does not electrically connected to the internal circuitry of the die unit. After the wafer is cut, a metal shielding layer is formed on the back surface and the side surfaces of the die unit. Afterwards, the die unit is mounted on the substrate to allow the second conductive structure to connect to the ground structure on the substrate and connect to the metal shielding layer. Thus, EMI shielding function is generated to efficiently suppress EMI and miniaturize the package.

公开(公告)号：US20160207762A1

公开(公告)日：2016-07-21

申请号：US14600256

申请日：2015-01-20

Applicant: SIGURD MICROELECTRONICS CORP.

Inventor： CHIH-WEI LU ,  KUAN-TIEN SHEN ,  TSAN-LIEN YEH

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00309 ,  B81B2201/0214 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2203/0154 ,  B81C2203/035

Abstract: A sensor package structure and method is characterized in connecting a sensor with a circuit substrate in a flip chip bonding method to enhance the structure strength and miniaturize the product; using a no-flow underfill glue to fill the gap between the sensor and the circuit substrate to protect the contacts of the flip chip structure, prevent the performance from being affected by the overflowing encapsulant, and promote the reliability of products. The present invention uses the no-flow underfill glue process to replace the processes of forming a dam and a soft protection layer and thus simplifies the fabrication process and reduces the fabrication cost.

Abstract translation: 传感器封装结构和方法的特征在于以倒装芯片接合方法将传感器与电路基板连接，以提高结构强度并使产品小型化; 使用无流动底部填充胶填充传感器和电路基板之间的间隙，以保护倒装芯片结构的触点，防止性能受溢出密封剂的影响，并提高产品的可靠性。 本发明使用无流动底部填充胶工艺来代替形成坝和软保护层的工艺，从而简化制造工艺并降低制造成本。

公开(公告)号：US20140042305A1

公开(公告)日：2014-02-13

申请号：US13953911

申请日：2013-07-30

Applicant: SIGURD MICROELECTRONICS CORP.

Inventor： CHIU-WEI LIU

IPC: G01V8/12

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention provides an optical package module, which comprises a substrate, a light emitting element, a first molding compound, a second molding compound, a light sensing element, and a cap. The light emitting element and the light sensing element are disposed on the substrate, and the first molding compound and the second molding compound are respectively molded upon the light sensing element and the light emitting element. The first molding compound comprises a first optical structure corresponding to the light sensing element, and the second molding compound comprises a second optical structure corresponding to the light emitting element. By designing the first and second optical structure of the optical package module, it achieves the purposes of improving light emitting and sensing efficiency of the present invention.

Abstract translation: 本发明提供一种光学封装模块，其包括基板，发光元件，第一模塑料，第二模塑料，光感测元件和盖。 发光元件和感光元件设置在基板上，并且第一模塑料和第二模塑料分别模制在光感测元件和发光元件上。 第一模塑料包括对应于感光元件的第一光学结构，第二模塑料包括对应于发光元件的第二光学结构。 通过设计光学封装模块的第一和第二光学结构，实现了提高本发明的发光和感测效率的目的。

公开(公告)号：US20160146920A1

公开(公告)日：2016-05-26

申请号：US14548472

申请日：2014-11-20

Applicant: SIGURD MICROELECTRONICS CORP.

Inventor： CHIEN-HUNG LIN ,  YI-CHENG TSAI ,  CHING-CHENG TIEN ,  CHI-CHUNG LIU

IPC: G01R35/00 ,  G01R27/06

CPC classification number: G01R35/005 ,  G01R27/32

Abstract: An RF parameter calibration method comprises steps: measuring an open-circuit parameter, a short-circuit parameter and a load parameter of an RF parameter circuit of a tested object; respectively substituting measured values of the open-circuit parameter, the short-circuit parameter and the load parameter into a directivity error equation, a signal source matching error equation, and a reflection path error equation to obtain a directivity error, a signal source matching error, and a reflection path error; substituting the directivity error, the signal source matching error and the reflection path error into an RF parameter equation to work out an actual value of an RF parameter; examining whether the actual value of the RF parameter is smaller than a preset dB value; if yes, undertaking calibration; if no, returning to undertake measurements once again. The present invention can replace the expensive standard calibration kit and achieve more precise parameter calibration.

Abstract translation: RF参数校准方法包括以下步骤：测量被测对象的RF参数电路的开路参数，短路参数和负载参数; 分别将开路参数，短路参数和负载参数的测量值代入方向性误差方程，信号源匹配误差方程和反射路径误差方程，以获得方向性误差，信号源匹配误差 ，反射路径误差; 将方向性误差，信号源匹配误差和反射路径误差代入射频参数方程，计算RF参数的实际值; 检查RF参数的实际值是否小于预设dB值; 如果是，进行校准; 如果没有，再次进行测量。 本发明可以替代昂贵的标准校准套件并实现更精确的参数校准。