公开(公告)号：US20190143684A1

公开(公告)日：2019-05-16

申请号：US16187023

申请日：2018-11-12

Applicant: SII Printek Inc.

Inventor： Shutaro YAMAMOTO ,  Daichi NISHIKAWA ,  Emiko OSAKA

IPC: B41J2/14 ,  B41J2/045

Abstract: There are provided a liquid jet head and a liquid jet recording device capable of enhancing the reliability. A liquid jet head according to an embodiment of the disclosure is a liquid jet head adapted to jet a liquid including an actuator plate having a plurality of ejection grooves each filled with the liquid, and a nozzle plate having a plurality of nozzle holes individually communicated with the respective ejection grooves, formed so as to have a profile smaller than a profile of the actuator plate, and bonded to the actuator plate so as to cover the plurality of ejection grooves, wherein a predetermined mark with which a position of the nozzle plate with respect to the actuator plate is checked is formed in an area outside a part corresponding to an outer periphery of the nozzle plate on a bonding surface of the actuator plate with the nozzle plate.

公开(公告)号：US20190143693A1

公开(公告)日：2019-05-16

申请号：US16189367

申请日：2018-11-13

Applicant: SII Printek Inc.

Inventor： Emiko OSAKA ,  Masakazu HIRATA ,  Shutaro YAMAMOTO ,  Kenji TAKANO ,  Takashi HITOMI

IPC: B41J2/16

Abstract: Provided herein is a method for manufacturing a jet hole plate that can improve ejection stability and head durability. A method for manufacturing a jet hole plate according to an embodiment of the present disclosure includes a punching step of pressing a first principal surface of a metal substrate with a punch to form an indentation in the first principal surface, and to form a raised portion in a second principal surface of the metal substrate at a position opposite to the indentation; a first polishing step of removing the raised portion by mechanical polishing to penetrate the metal substrate at the indentation to thereby form a jet hole; and a second polishing step of polishing at least one of the first principal surface and the second principal surface of the metal substrate by chemical polishing, electrolytic polishing, or chemical-mechanical polishing.