公开(公告)号：US11143554B2

公开(公告)日：2021-10-12

申请号：US16096996

申请日：2017-04-27

Applicant: SILIOS TECHNOLOGIES

Inventor： Stephane Tisserand ,  Laurent Roux ,  Marc Hubert ,  Vincent Sauget ,  Aurelien Faiola

IPC: G01J3/02 ,  G01J3/28 ,  G02B3/00 ,  G02B5/20 ,  G02B19/00 ,  G02B5/28

Abstract: The invention relates to a multispectral imaging device including: a photosensitive detector DET made up of a matrix of pixels; an array of microlenses ML1, ML2, ML3 reproducing the matrix of pixels; and a filter module MF formed by a matrix of individual filters λ1, λ2, λ3 reproducing the matrix of pixels. The device is remarkable in that the array of microlenses is arranged directly in contact with the detector DET, and the filter module MF is made on a substrate SS that is put into contact with the array of microlenses.

公开(公告)号：US11862658B2

公开(公告)日：2024-01-02

申请号：US17264166

申请日：2019-07-29

Applicant: SILIOS TECHNOLOGIES

Inventor： Stephane Tisserand ,  Laurent Roux ,  Marc Hubert ,  Vincent Sauget

IPC: H01L27/146 ,  H04N25/75 ,  H04N25/60 ,  H04N23/11

CPC classification number: H01L27/1464 ,  H01L27/1465 ,  H01L27/14634 ,  H04N23/11 ,  H04N25/60 ,  H04N25/75

Abstract: A hybrid multispectral imaging sensor, characterized in that it comprises a photosensitive backside-illumination detector (DET) that is made on a substrate (100) made of InP, and that is formed of a matrix of pixels (105, P1, P2, P3) that are themselves made in a structure based on InGaAs (103), and a filter module (MF) that is formed of a matrix of elementary filters (λ1, λ2, λ3) reproducing said matrix of pixels, and that is mounted into contact with said substrate (100), said substrate (100) made of InP having a thickness less than 50 μm, and preferably less than 30 μm.