公开(公告)号：US20230380061A1

公开(公告)日：2023-11-23

申请号：US18074006

申请日：2022-12-02

Applicant: SK hynix Inc.

Inventor： Byoung Ick Jang ,  Jung Cheol Yim ,  Kwang Min Nam ,  Jun Chang Yu

IPC: H05K1/11 ,  H05K1/18 ,  H01L25/18

CPC classification number: H05K1/115 ,  H05K1/181 ,  H01L25/18 ,  H05K2201/10159 ,  H05K2201/09445

Abstract: Provided herein may be a storage device and a printed circuit board for a solid state drive. The storage device may include a substrate including a conductive via, a plurality of memory devices mounted on a top surface of the substrate, a memory controller mounted on the top surface and electrically connected to the conductive via, and a port formed on a bottom surface of the substrate and electrically connected to the conductive via and a host device.