公开(公告)号：US20240090123A1

公开(公告)日：2024-03-14

申请号：US18469895

申请日：2023-09-19

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Robert Francis DARVEAUX ,  Ki Wook LEE ,  Takeshi FURUSAWA ,  Sundeep Nand NANGALIA ,  Russ Alan REISNER ,  John C. BALDWIN

IPC: H05K1/02 ,  H01Q1/22 ,  H04B1/10 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0243 ,  H01Q1/2283 ,  H04B1/10 ,  H05K1/113 ,  H05K1/183 ,  H05K2201/10098

Abstract: In some embodiments, nested filters can be implemented as a radio-frequency device that includes a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

公开(公告)号：US20240314940A1

公开(公告)日：2024-09-19

申请号：US18604301

申请日：2024-03-13

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Ki Wook LEE ,  Chien Jen WANG

IPC: H05K3/42 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/429 ,  H05K1/115 ,  H05K3/0047 ,  H05K2201/09518 ,  H05K2201/09545 ,  H05K2203/107

Abstract: According to certain aspects, devices and methods can be provided for forming packaging substrates having ringless vias. For instance, a method of forming one or more vias in a packaging substrate can include: laminating a plurality of layers of a packaging substrate; drilling a via hole through the plurality of layers using a through drill, the plurality of layers not including a capture pad or ring along a path of the through drill for drilling the via hole; and forming a via in the via hole using a plating process.

公开(公告)号：US20240321791A1

公开(公告)日：2024-09-26

申请号：US18604399

申请日：2024-03-13

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Ki Wook LEE ,  Chien Jen WANG

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L2224/02215 ,  H01L2224/03019 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05557

Abstract: According to certain aspects, a packaging substrate can include a plurality of layers including an outer layer, and one or more components on a surface of the outer layer. The one or more components can include a radio-frequency circuit, where the radio-frequency circuit is covered by a protective coating configured to reduce surface roughness of the outer layer and not covered by solder resist.

公开(公告)号：US20200077510A1

公开(公告)日：2020-03-05

申请号：US16558056

申请日：2019-08-31

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Robert Francis DARVEAUX ,  Ki Wook LEE ,  Takeshi FURUSAWA ,  Sundeep Nand NANGALIA ,  Russ Alan REISNER ,  John C. BALDWIN

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H01Q1/22 ,  H04B1/10

Abstract: Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

公开(公告)号：US20240087999A1

公开(公告)日：2024-03-14

申请号：US18464182

申请日：2023-09-08

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Chien Jen WANG ,  Ki Wook LEE ,  Yi LIU ,  Shaul BRANCHEVSKY ,  Cai LIANG

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H05K1/111 ,  H01L25/0655

Abstract: A packaging substrate assembly for fabricating a packaged module can include a packaging substrate having a surface, and an array of conductive pads implemented on the surface. The assembly can further include a conductive post formed over each conductive pad, with the conductive post including a first portion having a lateral dimension formed over the conductive pad and a second portion having a lateral dimension formed over the first portion. In some embodiments, the lateral dimension of the first portion is less than the lateral dimension of the second portion. In some embodiments, a dielectric layer can be implemented over the surface to cover the conductive pads and surround the first portion of each conductive post.