公开(公告)号：US20250076939A1

公开(公告)日：2025-03-06

申请号：US18240402

申请日：2023-08-31

Applicant: SMART Modular Technologies, Inc.

Inventor： Satyanarayan Iyer ,  Torry Steed ,  Luis Fukazawa

IPC: G06F1/20 ,  H05K7/20

Abstract: Memory modules comprise memory chips coupled to a surface of one or more substrates. The memory chips contain large numbers of storage cells that consume power during normal operation, generating heat in the memory chips and causing temperatures to increase. As the temperatures increase, leakage currents can increase in the memory chips, and performance of the memory chips can decrease. A memory module includes memory chips disposed on a substrate and an active cooling device disposed on the substrate to increase the rate at which heat is dissipated to reduce or maintain temperatures and thereby save power and improve performance. In some examples, the active cooling device is disposed on a side of a memory chip opposite to the card in the memory module to improve cooling of the memory chips. In some examples, the active cooling device is a thermoelectric device.