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    ELECTRONIC ASSEMBLY WITH THERMAL CHANNEL AND METHOD OF MANUFACTURE THEREOF
    1.
    发明申请
    ELECTRONIC ASSEMBLY WITH THERMAL CHANNEL AND METHOD OF MANUFACTURE THEREOF 有权
    具有热通道的电子组件及其制造方法

    公开(公告)号：US20140376174A1

    公开(公告)日：2014-12-25

    申请号：US13922136

    申请日：2013-06-19

    Applicant: SMART Storage Systems, Inc.

    Inventor： David Lee Dean ,  Dennis Bennett ,  Robert W. Ellis

    IPC: G06F1/20

    CPC classification number: G06F1/20 ,  G01R31/20 ,  G06F1/186 ,  H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K1/148 ,  H05K5/0026 ,  H05K7/20 ,  H05K2201/042 ,  H05K2201/058 ,  Y10T29/49002

    Abstract: An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail.

    Abstract translation: 电子组件和制造方法包括：具有圆形轨道和气流接头的气流支架，气流支架电连接圆形轨道和气流接头; 连接到圆形导轨的顶板，用于电连接顶板和圆形导轨; 以及附接到圆形导轨的底板，用于电连接顶板和圆形导轨，底板被定位成在顶板和底板之间形成热通道，用于引导空气通过圆形导轨的通风口。

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