STL model slicing method and device

    公开(公告)号:US12257781B2

    公开(公告)日:2025-03-25

    申请号:US17775296

    申请日:2020-12-18

    Abstract: An STL model slicing method includes: reading and loading an STL model; obtaining a first slice plane; according to a first set thickness, making the first slice plane be horizontally tangential to an STL model to obtain a first profile curve, which is a profile curve of a tangent plane of the STL model and the first slice plane; determining whether the profile curve contains a physical portion of the STL model; if the profile curve contains the physical portion of the STL model, filling the physical portion with white to obtain a white portion; determining a non-physical portion in the profile curve according to the physical portion; filling the non-physical portion with black to form a mask of the tangent plane; and projecting the mask onto a liquid photosensitive resin by means of a first 3D printer, and then curing the white portion to be a first cured profile.

    Multi-chip compatible compiling method and device

    公开(公告)号:US11579856B2

    公开(公告)日:2023-02-14

    申请号:US17782459

    申请日:2020-12-24

    Abstract: A multi-chip compatible compiling method includes: extracting common characteristic information of Makefiles; configuring variable attribute information of the Makefiles; obtaining a universal Makefile template for multiple chips according to the common characteristic information and the variable attribute information of the Makefiles; traversing a project to be compiled in the universal Makefile template by a compilation module, recording path information of a dependency file of the project to be compiled, replacing a variable value in the universal Makefile template, and determining automation configuration information of the universal Makefile template; invoking an incremental compilation mechanism of a Make tool according to the automation configuration information of the universal Makefile template to obtain a target Makefile of the project to be compiled; and processing the target Makefile by rule information and pseudo-target tag information in the Makefiles to obtain an executable file generated by compilation.

    Picture processing method in embedded system

    公开(公告)号:US11622169B1

    公开(公告)日:2023-04-04

    申请号:US17802073

    申请日:2021-10-09

    Abstract: An embodiment of the present invention provides a picture processing method in an embedded system. The picture processing method includes: performing a bit setting operation on an input/output register corresponding to a communication GPIO port of a camera module in the embedded system, so as to improve a picture collection speed of the camera module; compressing a collected picture using a preset picture compression algorithm and transmitting the compressed picture to a picture preprocessing unit in the embedded system; and filtering out, by the picture preprocessing unit, a picture background using a preset filtering algorithm to obtain picture features of a target object in the picture. With the picture processing method, requirements for an occupied memory resource are balanced while a picture collection speed and a picture data processing speed are increased.

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