公开(公告)号：US12257781B2

公开(公告)日：2025-03-25

申请号：US17775296

申请日：2020-12-18

Applicant: SOOCHOW UNIVERSITY

Inventor： Yihuai Wang ,  Tingting Xu ,  Jin Wang ,  Lianmin Shi ,  Rong Zhang

IPC: B29C64/386 ,  B29C64/129 ,  B33Y50/02

Abstract: An STL model slicing method includes: reading and loading an STL model; obtaining a first slice plane; according to a first set thickness, making the first slice plane be horizontally tangential to an STL model to obtain a first profile curve, which is a profile curve of a tangent plane of the STL model and the first slice plane; determining whether the profile curve contains a physical portion of the STL model; if the profile curve contains the physical portion of the STL model, filling the physical portion with white to obtain a white portion; determining a non-physical portion in the profile curve according to the physical portion; filling the non-physical portion with black to form a mask of the tangent plane; and projecting the mask onto a liquid photosensitive resin by means of a first 3D printer, and then curing the white portion to be a first cured profile.