公开(公告)号：US3838984A

公开(公告)日：1974-10-01

申请号：US35122473

申请日：1973-04-16

Applicant: SPERRY RAND CORP

Inventor： CRANE J ,  LAWSON J ,  PETSCHAUER R

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/36 ,  H05K3/42

CPC classification number: H05K1/113 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/16237 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/363 ,  H05K3/423 ,  H05K2201/0166 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/10674 ,  Y10S428/929 ,  Y10T428/12188 ,  Y10T428/12347 ,  Y10T428/12361 ,  Y10T428/12396 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/1275 ,  Y10T428/12882 ,  H01L2924/00

Abstract: A printed circuit lead frame that functions as a carrier of an integrated circuit (IC) uncased chip for initial handling and testing and later as a means for bonding the chip''s contacts to printed circuitry on a supporting substrate is disclosed. The lead frame includes a flexible insulating sheet member having a plurality of inner via holes arranged in a pattern to match that of the terminal contacts on the associated chip and a plurality of outer via holes arranged in a pattern to match that of the terminal pads on the supporting substrate member. Gold bumps in each of the inner and outer via holes extend beyond the bottom surface of the sheet member to make a conductively bonded contact with the associated terminal contacts on the associated chip and the associated terminal pads on the supporting substrate member while printed circuit leads affixed to the top surface of the sheet member conductively intercouple associated pairs of inner and outer gold bumps to complete the electrical coupling of the associated chip to the supporting substrate member.

Abstract translation: 公开了用作初始处理和测试的集成电路（IC）未占用芯片的载体的印刷电路引线框，并且稍后将其作为用于将芯片的触点接合到支撑基板上的印刷电路的装置。 引线框架包括柔性绝缘片构件，其具有以与图案中的端子触点相匹配的图案布置的多个内通孔，并且以与图案中的端子焊盘相匹配的多个外通孔 支撑基板部件。 内部和外部通孔中的每一个中的金凸起延伸超过片状构件的底表面，以使与印刷电路引线固定的相关联的芯片上的相关联的端子触点和支撑衬底构件上的相关联的端子焊盘导电地接合 到片状构件的顶表面导电地相互连接相关联的内和外金凸块对，以完成相关芯片与支撑衬底构件的电耦合。