公开(公告)号：US20240387400A1

公开(公告)日：2024-11-21

申请号：US18646903

申请日：2024-04-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JiSeon LEE ,  BumRyul MAENG ,  HyunKyu LEE

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L23/528

Abstract: A semiconductor device and a method for making the same are provided. The method includes: providing a package including: a substrate having a front substrate surface and a back substrate surface, wherein the substrate includes a plurality of singulation areas separating the substrate into a plurality substrate units; a plurality of first electronic components mounted on the front substrate surface and within the plurality substrate units, respectively; and an encapsulant formed on the front substrate surface and encapsulating the plurality of first electronic components; forming a plurality of trenches at the plurality of singulation areas, respectively, wherein each of the plurality of trenches has a first portion extending through the encapsulant and a second portion extending through the encapsulant and the substrate; and forming an EMI shield to cover the encapsulant and lateral surfaces of the plurality of substrate units exposed by the second portions of the plurality of trenches.

公开(公告)号：US20240421172A1

公开(公告)日：2024-12-19

申请号：US18746062

申请日：2024-06-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： BumRyul MAENG ,  MyungHo JUNG

IPC: H01L27/146

Abstract: An optical sensor package comprises: a base substrate having a window; a first optical sensor mounted on a front surface of the base substrate, with its light receiving surface facing towards and aligned with the window; a first light-pervious encapsulant mold covering the light receiving surface of the first optical sensor; a first encapsulant layer formed on the front surface of the base substrate, wherein the first encapsulant layer comprises interlayer connects passing therethrough; an interposer mounted on the first encapsulant layer and electrically coupled to the base substrate through the interlayer connects of the first encapsulant layer; a second optical sensor mounted on a front surface of the interposer, with its light receiving surface facing away from the interposer; a second light-pervious encapsulant mold covering the light receiving surface of the second optical sensor; and a second encapsulant layer formed on the front surface of the interposer.

公开(公告)号：US20240421138A1

公开(公告)日：2024-12-19

申请号：US18739404

申请日：2024-06-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JiSeon LEE ,  BumRyul MAENG ,  HyunKyu LEE

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/36 ,  H01L23/538 ,  H01L25/00

Abstract: A semiconductor package and a method for making the same are provided. The semiconductor package includes: a substrate having a lower substrate surface and an upper substrate surface; a first interposer attached on the upper substrate surface; at least one first electronic component mounted on and electronically connected with the first interposer; a second interposer disposed above the at least one first electronic component, wherein the second interposer has a concave portion and a protruding portion, the at least one first electronic component is accommodated in the concave portion, and the protruding portion is mounted on the upper substrate surface; and at least one second electronic component mounted on and electronically connected with the second interposer.

公开(公告)号：US20240387577A1

公开(公告)日：2024-11-21

申请号：US18668225

申请日：2024-05-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HyunKyu LEE ,  BumRyul MAENG ,  JiSeon LEE

IPC: H01L27/146

Abstract: An optical sensor package is disclosed. The package comprises: a package substrate having a front surface and a back surface; an optical sensor mounted on the package substrate, wherein the optical sensor is encapsulated by a first light-pervious encapsulant mold; a light source mounted on the front surface of the package substrate, wherein the light source is encapsulated by a second light-pervious encapsulant mold; a central interposer mounted on the front surface of the package substrate via a support wall and between the optical sensor and the light source, wherein the central interposer and the support wall are light-impervious to prevent the light source from illuminating directly onto the optical sensor; and at least one electronic component mounted on the central interposer, wherein the at least one electronic component is electrically coupled to the optical sensor via a first interconnect that passes through the first light-pervious encapsulant mold.

公开(公告)号：US20240363368A1

公开(公告)日：2024-10-31

申请号：US18646867

申请日：2024-04-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： MyungHo JUNG ,  BumRyul MAENG

IPC: H01L21/56 ,  G01S7/481 ,  H01L23/31 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L21/56 ,  G01S7/4813 ,  H01L23/3121 ,  H01L23/49811 ,  H01L25/16

Abstract: A method for forming a sensor package, comprising: providing a substrate, wherein one or more connectors are attached onto a front side of the substrate; forming an encapsulant layer on the front side of the substrate, wherein the one or more connectors are exposed from the encapsulant layer; forming a sacrificial layer on the encapsulant layer, wherein a periphery of the sacrificial layer is smaller than a periphery of the encapsulant layer, and wherein the sacrificial layer is molded as including a base portion, a step portion with a periphery smaller than a periphery of the base portion, and at least one extrusion portion on the base portion; applying an encapsulant material surrounding the base portion of the sacrificial layer, to enlarge the encapsulant layer; removing the sacrificial layer from the encapsulant layer, to form a cavity corresponding to the step portion and the base portion of the sacrificial layer, and to form at least one hole corresponding to the at least one extrusion portion on the enlarged encapsulant layer; positioning a sensor within the cavity and connecting the sensor to the one or more connectors; and attaching a cap onto the enlarged encapsulant layer to cover the cavity.

公开(公告)号：US20240405049A1

公开(公告)日：2024-12-05

申请号：US18673384

申请日：2024-05-24

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： BumRyul MAENG ,  MyungHo JUNG ,  HeeSoo LEE

IPC: H01L27/146

Abstract: A method for forming a sensor package is disclosed. The method comprises: providing a sensor; forming an optical filter and a transparent mold on the sensor to form a sensor assembly; providing a substrate, wherein one or more connectors are attached on a front surface of the substrate; forming a first encapsulant layer on the front surface of the substrate, wherein the one or more connectors are exposed from the first encapsulant layer; disposing the sensor assembly on the first encapsulant layer; connecting the sensor with the one or more connectors; and forming a second encapsulant layer on the first encapsulant layer to cover the sensor assembly.

公开(公告)号：US20240371812A1

公开(公告)日：2024-11-07

申请号：US18655254

申请日：2024-05-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： MyungHo JUNG ,  BumRyul MAENG

IPC: H01L23/00 ,  H01L21/683 ,  H01L23/31 ,  H01L25/065

Abstract: An electronic package and a packaging method are provided. The packaging method comprises: forming on a carrier film a first photoresist pattern having multiple sets of first openings; filling in the multiple sets of first openings of the first photoresist pattern with a solder material to form multiple sets of solder bumps; forming on the first photoresist pattern a second photoresist pattern having multiple second openings each exposing a set of the sets of solder bumps; attaching one or more electronic components to the set of solder bumps in each of the second openings; filling in the second openings of the second photoresist pattern with an encapsulant material to form an encapsulant layer that at least partially encapsulates the one or more electronic components in each of the second openings; and removing the second photoresist pattern from the carrier film to form multiple electronic packages.

公开(公告)号：US20240096920A1

公开(公告)日：2024-03-21

申请号：US18459014

申请日：2023-08-30

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： MyungHo JUNG ,  SangHyun SON ,  YoungUk NOH ,  BumRyul MAENG

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687

Abstract: Provided is a sensor assembly, comprising: a sensor, wherein the sensor comprises a sensor front surface comprising a sensor area and an interconnect area; at least one filter layer formed on top of the sensor front surface, wherein the at least one filter layer covers and is in direct contact with the sensor area of the sensor; a first encapsulant layer formed on top of the at least one filter layer, wherein the first encapsulant layer is transmissive to light; and wherein the interconnect area is at least partially exposed from the at least one filter layer and the first encapsulant layer.