公开(公告)号：US20240421138A1

公开(公告)日：2024-12-19

申请号：US18739404

申请日：2024-06-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JiSeon LEE ,  BumRyul MAENG ,  HyunKyu LEE

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/36 ,  H01L23/538 ,  H01L25/00

Abstract: A semiconductor package and a method for making the same are provided. The semiconductor package includes: a substrate having a lower substrate surface and an upper substrate surface; a first interposer attached on the upper substrate surface; at least one first electronic component mounted on and electronically connected with the first interposer; a second interposer disposed above the at least one first electronic component, wherein the second interposer has a concave portion and a protruding portion, the at least one first electronic component is accommodated in the concave portion, and the protruding portion is mounted on the upper substrate surface; and at least one second electronic component mounted on and electronically connected with the second interposer.

公开(公告)号：US20240387400A1

公开(公告)日：2024-11-21

申请号：US18646903

申请日：2024-04-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JiSeon LEE ,  BumRyul MAENG ,  HyunKyu LEE

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L23/528

Abstract: A semiconductor device and a method for making the same are provided. The method includes: providing a package including: a substrate having a front substrate surface and a back substrate surface, wherein the substrate includes a plurality of singulation areas separating the substrate into a plurality substrate units; a plurality of first electronic components mounted on the front substrate surface and within the plurality substrate units, respectively; and an encapsulant formed on the front substrate surface and encapsulating the plurality of first electronic components; forming a plurality of trenches at the plurality of singulation areas, respectively, wherein each of the plurality of trenches has a first portion extending through the encapsulant and a second portion extending through the encapsulant and the substrate; and forming an EMI shield to cover the encapsulant and lateral surfaces of the plurality of substrate units exposed by the second portions of the plurality of trenches.

公开(公告)号：US20240387577A1

公开(公告)日：2024-11-21

申请号：US18668225

申请日：2024-05-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HyunKyu LEE ,  BumRyul MAENG ,  JiSeon LEE

IPC: H01L27/146

Abstract: An optical sensor package is disclosed. The package comprises: a package substrate having a front surface and a back surface; an optical sensor mounted on the package substrate, wherein the optical sensor is encapsulated by a first light-pervious encapsulant mold; a light source mounted on the front surface of the package substrate, wherein the light source is encapsulated by a second light-pervious encapsulant mold; a central interposer mounted on the front surface of the package substrate via a support wall and between the optical sensor and the light source, wherein the central interposer and the support wall are light-impervious to prevent the light source from illuminating directly onto the optical sensor; and at least one electronic component mounted on the central interposer, wherein the at least one electronic component is electrically coupled to the optical sensor via a first interconnect that passes through the first light-pervious encapsulant mold.