公开(公告)号：US20240290671A1

公开(公告)日：2024-08-29

申请号：US18582697

申请日：2024-02-21

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Gwang KIM ,  HunTeak LEE

IPC: H01L23/13 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/60 ,  H01L23/66 ,  H01L25/00 ,  H01L25/16

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/31 ,  H01L23/49822 ,  H01L23/60 ,  H01L23/66 ,  H01L25/16 ,  H01L25/50 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/1815

Abstract: A semiconductor package comprises: a package substrate comprising: a first portion comprising a first conductive pattern extending therewithin having a first thickness; and a second portion comprising a second conductive pattern extending therewithin having a second thickness smaller than the first thickness; at least one electronic component mounted on the second portion and electrically coupled to the second conductive pattern; an encapsulant layer formed on the second portion of the package substrate and covering the at least one electronic component, wherein the encapsulant layer comprises a cavity region; a connector assembly formed within the cavity region of the encapsulant layer and electrically coupled to the second conductive pattern, wherein the connector assembly is exposed from the encapsulant layer to allow for electrical connection with an external device; and a partial shielding layer formed on at least regions other than the cavity region of the encapsulant layer.