公开(公告)号：US20230411831A1

公开(公告)日：2023-12-21

申请号：US18334375

申请日：2023-06-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak LEE ,  SangHo SONG ,  YeonJee LEE

IPC: H01Q1/24 ,  H01L23/66 ,  H01L23/64 ,  H01L23/498

CPC classification number: H01Q1/243 ,  H01L23/66 ,  H01L23/645 ,  H01L23/49816 ,  H01L2223/6677

Abstract: An antenna module comprises: an antenna body comprising a first surface for attaching the antenna module to an external substrate, and a second surface through which the antenna module transmits and receives electromagnetic signals, wherein the first surface is opposite to the second surface; an antenna conductive pattern formed within the antenna body; and a shielding fence laterally surrounding the antenna conductive pattern for shielding electromagnetic interferences.

公开(公告)号：US20240290671A1

公开(公告)日：2024-08-29

申请号：US18582697

申请日：2024-02-21

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Gwang KIM ,  HunTeak LEE

IPC: H01L23/13 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/60 ,  H01L23/66 ,  H01L25/00 ,  H01L25/16

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/31 ,  H01L23/49822 ,  H01L23/60 ,  H01L23/66 ,  H01L25/16 ,  H01L25/50 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/1815

Abstract: A semiconductor package comprises: a package substrate comprising: a first portion comprising a first conductive pattern extending therewithin having a first thickness; and a second portion comprising a second conductive pattern extending therewithin having a second thickness smaller than the first thickness; at least one electronic component mounted on the second portion and electrically coupled to the second conductive pattern; an encapsulant layer formed on the second portion of the package substrate and covering the at least one electronic component, wherein the encapsulant layer comprises a cavity region; a connector assembly formed within the cavity region of the encapsulant layer and electrically coupled to the second conductive pattern, wherein the connector assembly is exposed from the encapsulant layer to allow for electrical connection with an external device; and a partial shielding layer formed on at least regions other than the cavity region of the encapsulant layer.

公开(公告)号：US20230402400A1

公开(公告)日：2023-12-14

申请号：US18332779

申请日：2023-06-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HunTeak LEE ,  SangHo SONG ,  YeonJee LEE ,  HeeSoo LEE

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56

Abstract: A method for making a semiconductor device comprises: providing a substrate having a first region and a second region, wherein the first region comprises at least one electronic component and a conductive pattern formed therein; forming a conductive bar on the conductive pattern; forming an encapsulant layer in the first region of the substrate to cover the at least one electronic component, the conductive bar and the conductive pattern; removing a portion of the encapsulant layer that is above the conductive bar to expose the conductive bar and separate the encapsulant layer into a main portion and a peripheral portion; disposing a deposition mask above the substrate to cover the second region; and depositing a conductive material on the substrate to form a shielding layer on the substrate which is not covered by the deposition mask.