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公开(公告)号：US09196590B2
公开(公告)日：2015-11-24
申请号：US14640237
申请日：2015-03-06
Inventor： Francis Steffen , Delphine Mathey , Gilbert Assaud , Rémi Brechignac
IPC: H01L23/28 , H01L23/00 , H01L23/31 , H01L23/04 , H01L23/522 , H01L21/311 , H01L21/56
CPC classification number: H01L23/562 , H01L21/31105 , H01L21/565 , H01L23/04 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/315 , H01L23/522 , H01L23/57 , H01L23/573 , H01L24/32 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/12042 , H01L2924/15174 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
Abstract: An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.
Abstract translation: 电子封装包括安装到支撑板并由封装体封装的集成电路芯片。 该包装包括至少一个削弱的深穿孔。 穿孔形成在支撑板或封装体中，并且用于减小包装件垂直于支撑板的弯曲应力的阻力。
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公开(公告)号：US09226393B2
公开(公告)日：2015-12-29
申请号：US14512179
申请日：2014-10-10
Applicant: STMicroelectronics (Rousset) SAS
Inventor： Francis Steffen , Gilbert Assaud
IPC: B41J2/14 , B41J2/175 , H05K1/00 , H05K1/02 , G06K19/073 , G06K19/077 , H05K1/03 , H05K1/11 , H05K1/18 , H05K3/20 , H05K3/30
CPC classification number: H05K1/028 , B41J2/1753 , B41J2/17546 , B41J2/17559 , G06K19/0739 , G06K19/07798 , H05K1/0283 , H05K1/0313 , H05K1/118 , H05K1/181 , H05K3/20 , H05K3/30 , H05K2201/10007 , Y10T29/49128 , Y10T29/4913
Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
Abstract translation: 一种电路，包括柔性基板和至少一个附着到基板的电气元件，所述基板包括布置在所述电气元件附近的至少一个空腔，并且有助于响应于所述基板的弯曲或拉伸来破坏或变形所述电气元件。 尤其适用于制造防撕裂电子微型模块。
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公开(公告)号：US20150262941A1
公开(公告)日：2015-09-17
申请号：US14640237
申请日：2015-03-06
Inventor： Francis Steffen , Delphine Mathey , Gilbert Assaud , Rémi Brechignac
IPC: H01L23/00 , H01L21/311 , H01L23/522 , H01L23/31 , H01L23/04
CPC classification number: H01L23/562 , H01L21/31105 , H01L21/565 , H01L23/04 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/315 , H01L23/522 , H01L23/57 , H01L23/573 , H01L24/32 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/12042 , H01L2924/15174 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
Abstract: An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.
Abstract translation: 电子封装包括安装到支撑板并由封装体封装的集成电路芯片。 该包装包括至少一个削弱的深穿孔。 穿孔形成在支撑板或封装体中，并且用于减小包装件垂直于支撑板的弯曲应力的阻力。
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公开(公告)号：US20150029275A1
公开(公告)日：2015-01-29
申请号：US14512179
申请日：2014-10-10
Applicant: STMicroelectronics (Rousset) SAS
Inventor： Francis Steffen , Gilbert Assaud
CPC classification number: H05K1/028 , B41J2/1753 , B41J2/17546 , B41J2/17559 , G06K19/0739 , G06K19/07798 , H05K1/0283 , H05K1/0313 , H05K1/118 , H05K1/181 , H05K3/20 , H05K3/30 , H05K2201/10007 , Y10T29/49128 , Y10T29/4913
Abstract: A circuit including a flexible substrate and at least one electric element attached to the substrate, the substrate including at least one cavity arranged near the electric element and helping to break or distort the electric element in response to a flexion or stretching of the substrate. Application in particular is to the manufacture of tear-proof electronic micromodules.
Abstract translation: 一种电路，包括柔性基板和至少一个附着到基板的电气元件，所述基板包括布置在所述电气元件附近的至少一个空腔，并且有助于响应于所述基板的弯曲或拉伸来破坏或变形所述电气元件。 尤其适用于制造防撕裂电子微型模块。
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