公开(公告)号：US20170133152A1

公开(公告)日：2017-05-11

申请号：US15318472

申请日：2015-07-01

Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Masahiko KOUCHI ,  Tetsuya SHIMOMURA

IPC: H01F38/14 ,  H05K1/14 ,  H02J7/02 ,  H05K1/11

CPC classification number: H01F38/14 ,  H01F27/2804 ,  H01F27/365 ,  H01F2027/2809 ,  H02J7/025 ,  H02J50/12 ,  H05K1/115 ,  H05K1/144 ,  H05K1/148 ,  H05K1/165 ,  H05K3/4635 ,  H05K2201/041 ,  H05K2201/09227 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10098

Abstract: A printed circuit board according to an embodiment of the present invention includes, alternately, at least one insulating layer containing a synthetic resin as a main component; and a plurality of conductive layers including circuit patterns, wherein the plurality of circuit patterns of the plurality of conductive layers form a spiral pattern in plan view, and the plurality of circuit patterns are connected together via a plurality of through-holes so as to form a single closed loop in which a current flows counterclockwise or clockwise in an entirety of the spiral pattern. The conductive layers are preferably formed on both surfaces of the at least one insulating layer so as to form a pair. The spiral pattern includes a plurality of multi-row circuits arranged to form multi-rows, and a bridging circuit that connects an end portion of one multi-row circuit of one of the conductive layers to an end portion of another multi-row circuit of the other conductive layer, the other multi-row circuit being adjacent to the one multi-row circuit.