公开(公告)号：US11751331B2

公开(公告)日：2023-09-05

申请号：US17389564

申请日：2021-07-30

Applicant: Samsung Display Co., LTD.

Inventor： Kyu Min Han ,  Seung Hwan Cheong

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/118 ,  H05K1/0218 ,  H05K2201/0715 ,  H05K2201/10128

Abstract: A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.

公开(公告)号：US11600687B2

公开(公告)日：2023-03-07

申请号：US17198947

申请日：2021-03-11

Applicant: Samsung Display Co., Ltd.

Inventor： Seung Hwan Cheong ,  Sung Bae Park ,  Myung Joon Yoon ,  Kyu Min Han

IPC: H01L23/552 ,  H01L27/32 ,  H01L23/31 ,  H01L23/498 ,  G06F3/147

Abstract: An electronic device package includes: a substrate including a central region, and a first side region and a second side region at opposite sides of the central region; a first component in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component in the central region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcement member in the central region and overlapping the second component, the reinforcement member having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.

公开(公告)号：US11540391B2

公开(公告)日：2022-12-27

申请号：US16831122

申请日：2020-03-26

Applicant: Samsung Display Co., Ltd.

Inventor： Seung Hwan Cheong ,  Ah Young Son ,  Chan Yoon Woo

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  H05K1/02

Abstract: A display device includes: a display panel; and a first substrate connected to the display panel, wherein the first substrate comprises: a first base substrate; a first wiring layer having a plurality of first signal wirings on the first base substrate; and a first ground wiring layer on the first wiring layer, wherein the first ground wiring layer comprises a mesh pattern area and a non-mesh pattern area, wherein the mesh pattern area comprises a plurality of first mesh patterns and openings surrounded by adjacent first mesh patterns, and the non-mesh pattern area comprises a plurality of second mesh patterns and non-mesh patterns surrounded by adjacent second mesh patterns, wherein the non-mesh patterns are physically connected to the adjacent second mesh patterns.

公开(公告)号：US12219707B2

公开(公告)日：2025-02-04

申请号：US18223245

申请日：2023-07-18

Applicant: Samsung Display Co., LTD.

Inventor： Kyu Min Han ,  Seung Hwan Cheong

IPC: H05K1/11 ,  H05K1/02

Abstract: A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.

公开(公告)号：US11264742B2

公开(公告)日：2022-03-01

申请号：US16837919

申请日：2020-04-01

Applicant: Samsung Display Co., Ltd.

Inventor： Chan Yoon Woo ,  Seung Hwan Cheong ,  Ah Young Son

IPC: H05K7/00 ,  H01R12/62 ,  H05K1/14

Abstract: The display device includes: a display panel; a first circuit board having a first portion connected to one portion of the display panel and comprising a connector; and a second circuit board electrically connected to the first circuit board through the connector, wherein the first portion includes a base film, a dummy pad disposed on the base film, and a first solder mask partially covering the dummy pad and exposing a portion of the dummy pad, the dummy pad includes a covered region covered by the first solder mask and an exposed region exposed by the first solder mask, and a solder ball, The exposed region of the dummy pad is connected to the connector through a solder ball.