公开(公告)号：US20160374198A1

公开(公告)日：2016-12-22

申请号：US15002428

申请日：2016-01-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Heung-Kyu KIM ,  Suk-Hyeon CHO ,  Chil-Woo KWON ,  Yul-Kyo CHUNG ,  Going-Sik KIM

IPC: H05K1/03

CPC classification number: H05K3/4605 ,  H05K1/0271 ,  H05K3/46 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/09136

Abstract: A printed circuit board includes a core layer including a glass core, a first resin layer disposed on a first surface of the glass core, and a second resin layer formed on a second surface of the glass core; build-up layers disposed on the first and second surfaces of the core layer; and a conductive pattern formed in multiple layers on the build-up layers, wherein the core layer has asymmetric coefficients of thermal expansion opposing sides thereof with respect to a center of the glass core in a thickness direction.

Abstract translation: 印刷电路板包括芯层，其包括玻璃芯，设置在玻璃芯的第一表面上的第一树脂层和形成在玻璃芯的第二表面上的第二树脂层; 设置在芯层的第一和第二表面上的堆积层; 以及形成在所述积层层上的多层的导电图案，其中所述芯层相对于所述玻璃芯的中心在厚度方向上相对侧面具有不对称的热膨胀系数。

公开(公告)号：US20160234929A1

公开(公告)日：2016-08-11

申请号：US15019714

申请日：2016-02-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Joon-Sung LEE ,  Suk-Hyeon CHO ,  Yong-Sam LEE

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H05K1/185 ,  H05K3/0029 ,  H05K3/4605 ,  H05K2201/09036 ,  H05K2201/09136 ,  H05K2201/09827 ,  H05K2201/10204

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a core substrate having a cavity formed therein and a dummy chip inserted in the cavity.

Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括其中形成有空腔的芯基板和插入空腔中的虚拟芯片。