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公开(公告)号：US20160234929A1
公开(公告)日：2016-08-11
申请号：US15019714
申请日：2016-02-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Joon-Sung LEE , Suk-Hyeon CHO , Yong-Sam LEE
CPC classification number: H05K1/0271 , H05K1/185 , H05K3/0029 , H05K3/4605 , H05K2201/09036 , H05K2201/09136 , H05K2201/09827 , H05K2201/10204
Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a core substrate having a cavity formed therein and a dummy chip inserted in the cavity.
Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括其中形成有空腔的芯基板和插入空腔中的虚拟芯片。
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公开(公告)号：US20160219709A1
公开(公告)日：2016-07-28
申请号：US14990046
申请日：2016-01-07
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Joon-Sung LEE , Yong-Sam LEE , Seok-Hwan AHN , Jae-Hoon CHOI
CPC classification number: H05K1/186 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/3511 , H05K1/113 , H05K1/185 , H05K3/284 , H05K3/4697 , H05K2201/10 , H05K2201/10015 , H05K2201/10636 , Y02P70/611 , H01L2924/00
Abstract: Disclosed is an embedded board and a method of manufacturing the same. The embedded board may include an insulating layer a first circuit layer formed inside the insulating layer a second circuit layer formed on an upper part of the first circuit layer, and the second circuit layer being disposed inside the insulating layer, a first electronic element arranged inside the insulating layer, the first electronic element being spaced apart from the second circuit layer, a metal pillar formed between the first circuit layer and the second circuit layer or the first electronic element, and a first via formed on the upper part of the second circuit layer inside the insulating layer.
Abstract translation: 公开了一种嵌入式电路板及其制造方法。 嵌入式板可以包括绝缘层，第一电路层，形成在绝缘层的内部，形成在第一电路层的上部的第二电路层，第二电路层设置在绝缘层的内部，第一电子元件设置在内部 绝缘层，第一电子元件与第二电路层间隔开，形成在第一电路层和第二电路层或第一电子元件之间的金属柱，以及形成在第二电路的上部的第一通孔 绝缘层内层。
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