Abstract:
Plasma processing apparatuses, substrate bonding systems, and substrate bonding methods are provided. The plasma processing apparatus includes a plasma process chamber that includes a process space, a load-lock chamber connected to the process space, a first vacuum pump that adjusts a pressure of the load-lock chamber, a process gas supply that supplies the process space with a process gas, and an H2O supply that supplies the process space with H2O. The plasma process chamber includes a chuck that supports a substrate and a plasma electrode to which a radio-frequency (RF) power is applied.
Abstract:
A method, apparatus, and system for paying are provided. The method for paying of an electronic device includes: receiving item order information from a POS terminal; determining a payment method by considering at least one of a discount benefit and a reward point saving benefit based on the received item order information; and requesting a payment approval for the item order information in the determined payment method.
Abstract:
Provided is a message service providing method and portable device supporting the same, which includes generating at least one of a key input signal and a sliding sensor signal; and writing a message by activating a message write window set according to an environment of an application program which is being activated depending on generation of at least one of the key input signal and the sliding sensor signal.
Abstract:
Disclosed is method for sharing the content of a first electronic device, including transmitting, when connecting a call with a second electronic device using a first network, a notification on the call connection to a third electronic device that is connected with a second network, and transmitting, when the content related to the notification is received from the third electronic device during the call, the received content to the second electronic device.