公开(公告)号：US20170111990A1

公开(公告)日：2017-04-20

申请号：US15249931

申请日：2016-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho-hyeuk IM

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0281 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: A printed circuit board (PCB) that may improve the reliability of an electronic apparatus includes a base substrate having a first edge and a second edge on both sides of the base substrate, the base substrate having a bending region including an opening adjacent to the first edge, an opening adjacent to the second edge, and mounting regions extending from both ends of the bending region and including device mounting portions, a connection line formed on the base substrate and crossing the bending region, the connection line configured to connect the device mounting portions of the mounting regions extending from the both ends of the bending region; and a guard pattern formed on each or at least one of a top surface and a bottom surface of the base substrate along a boundary of each or at least one of the openings.