公开(公告)号：US20240387231A1

公开(公告)日：2024-11-21

申请号：US18521678

申请日：2023-11-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungho PARK ,  Hojae KIM

IPC: H01L21/683 ,  H01L21/687

Abstract: A collet for pickup a semiconductor chip may include a base and a holder. The base may have a first surface oriented toward the semiconductor chip and a second surface opposite to the first surface. The holder may be arranged at a central portion of the first surface of the base to fix the semiconductor chip using vacuum. An edge portion of the first surface of the base may be exposed. Thus, any structure may not exist in the edge portion of the base corresponding to a peripheral region of the collet so that a peripheral semiconductor chip vertically erected in picking the semiconductor chip from a film may not interfere with the holder. As a result, the vertically erected semiconductor chip may not be stuck in the holder to prevent damages of other semiconductor chip by the vertically erected semiconductor chip.

公开(公告)号：US20210074562A1

公开(公告)日：2021-03-11

申请号：US16839139

申请日：2020-04-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hojae KIM

IPC: H01L21/67 ,  H01L21/683

Abstract: An ultraviolet (UV) irradiation apparatus includes: a base module configured to support a wafer including a plurality of semiconductor chips, wherein the plurality of semiconductor chips are connected with each other via a die attach film (DAF); a vacuum module configured to provide the wafer with a vacuum and to remove air from the DAF; a UV irradiation module configured to irradiate UV to the wafer in the vacuum module; and an expanding module configured to expand the wafer in the vacuum module.