公开(公告)号：US11984345B2

公开(公告)日：2024-05-14

申请号：US18135017

申请日：2023-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilyoung Han ,  Hunyong Park ,  Sohee Han ,  Nohsung Kwak

IPC: H01L21/687

CPC classification number: H01L21/68742 ,  H01L21/68785

Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.

公开(公告)号：US20250137136A1

公开(公告)日：2025-05-01

申请号：US18919340

申请日：2024-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hunyong Park ,  Yeontae Kim ,  Janghwi Lee ,  Sangwoo Bae ,  Jungchul Lee

IPC: C23C16/48

Abstract: A layer deposition apparatus includes a process chamber configured to provides a space for processing a substrate, the process chamber including an upper chamber and a lower chamber that define an inner space; a substrate support disposed within the process chamber and configured to support the substrate; a lamp heating portion disposed above the upper chamber outside the process chamber and including a plurality of light sources configured to irradiate light onto the substrate through the upper chamber; and an interference thin layer pattern disposed on an upper surface of the upper chamber and configured to reflect at least a portion of light from the plurality of light sources.

公开(公告)号：US20240218561A1

公开(公告)日：2024-07-04

申请号：US18515664

申请日：2023-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Janghwi Lee ,  Yeontae Kim ,  Junbum Park ,  Hunyong Park ,  Suhwan Park ,  Sangwoo Bae ,  Motoshi Sakai ,  Wondon Joo ,  Jaeho Jin

IPC: C30B25/16 ,  C30B25/12

CPC classification number: C30B25/16 ,  C30B25/12

Abstract: A thin-film deposition apparatus includes: a housing; a chamber located within the housing and providing an internal space; a platform disposed within the chamber and configured to support a substrate; a reflector disposed within the housing and disposed outside the chamber; a light source disposed between opposing walls of the reflector and configured to radiate light onto the substrate; a light receiver disposed within the housing, spaced apart from the light source with a portion of the reflector therebetween, and having a hole through which light emitted from the substrate is introduced; an optical cable connected to the light receiver and extending to the outside of the housing; and a sensor disposed outside the housing, connected to the optical cable, and configured to measure a temperature of the substrate by analyzing light transmitted from the optical cable.

公开(公告)号：US11651990B2

公开(公告)日：2023-05-16

申请号：US16712413

申请日：2019-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilyoung Han ,  Hunyong Park ,  Sohee Han ,  Nohsung Kwak

IPC: H01L21/687

CPC classification number: H01L21/68742 ,  H01L21/68785

Abstract: The present disclosure is related to a substrate processing apparatus. The substrate processing apparatus may include a chuck including a plurality of pin holes and a plurality of lift pins positioned to rise and fall through the plurality of pin holes. The substrate processing apparatus may include a lift plate configured to raise and lower the lift pins. The plurality of lift pins may include a lift pin having a rod shape configured to move up and down in a pin hole of the plurality of pin holes, a flexure coupled to a lower portion of the lift pin, a weight body positioned underneath the lift plate, and a weight string connecting the flexure and the weight body. The lift plate may include a string hole through which the weight string passes through.