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公开(公告)号:US20240288265A1
公开(公告)日:2024-08-29
申请号:US18372391
申请日:2023-09-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jinyong Kim , Yasuhiro Hidaka , Wookrae Kim , Ingi Kim , Jinseob Kim
IPC: G01B11/02
CPC classification number: G01B11/02 , G01B2210/56
Abstract: Provided is a semiconductor measurement apparatus that includes: a lighting unit comprising a light source, and a light modulator configured to decompose a light output by the light source into a plurality of wavelength bands and generate an output light of at least two selected wavelength bands; a first optical unit comprising an illumination polarizing element disposed in a path of the output light; a second optical unit comprising a beam splitter, an objective lens configured to allow light having passed through the first optical unit to be incident onto a sample, and a self-interference generator disposed on a path of a reflected light; a sensor configured to output an original image representing an interference pattern of light having passed through the self-interference generator; and a controller configured to process the original image and determine a selected critical dimension of a structure included in the sample.
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公开(公告)号:US20240201104A1
公开(公告)日:2024-06-20
申请号:US18533528
申请日:2023-12-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: KENJI SUZUKI , Ingi Kim , Mitsunori Numata , Shinji Ueyama , Tomoki Onishi
CPC classification number: G01N21/9501 , G01N21/01 , G01N35/0099
Abstract: An inspection device improves accuracy characteristics of an (MRAM), the inspection device including a stage on which a MRAM element is fixed, and electromagnets generating a first magnetic field. A magnetic field having a component in a direction perpendicular to the stage is changeable from a first direction to a second direction according to a position on the stage. A second magnetic field in which a direction of a magnetic field component is parallel to the stage changes from a third direction to a fourth direction according to the position on the stage, an optical system illuminating the MRAM element with light including polarized light, and condensing reflected light from reflected illumination light from the MRAM element, and a detector detecting reflected light when the position of the MRAM element is changed, and when the position of the MRAM element in the second magnetic field is changed.
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公开(公告)号:US11823927B2
公开(公告)日:2023-11-21
申请号:US17229197
申请日:2021-04-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyunghun Han , Ingi Kim , Sangwoo Bae , Jungchul Lee , Minhwan Seo , Myeongock Ko , Youngjoo Lee , Taehyun Kim , Seulgi Lee
CPC classification number: H01L21/67288 , G01N21/41 , G01N21/65 , G01N21/9505 , G02B7/021 , G06T5/20 , G06T7/0004 , G01N2021/653 , G01N2201/06113 , G06T2207/30148
Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.
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公开(公告)号:US20250003734A1
公开(公告)日:2025-01-02
申请号:US18639332
申请日:2024-04-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sungyoon Ryu , Ingi Kim , Suhwan Park , Inkeun Baek , Younghoon Sohn , Soobin Sinn , Yusin Yang , Sunhong Jun , Ikseon Jeon
IPC: G01B11/06
Abstract: A measuring system measures an overall resistance of two or more films on a substrate/measurement object by a terahertz absorption measurement and an overall film thickness by a photoacoustic measurement. The system estimates a first film thickness based on the overall resistance, then subtracts this estimated thickness from the overall film thickness measured by the photoacoustic measurement. The system includes a source unit to output a laser beam. A first pump-probe unit receives the laser beam and performs a photoacoustic test on the measurement object. A second pump-probe unit receives the laser beam and performs a terahertz signal test on the measurement object. The system also includes a stage to support the measurement object and controls for controlling elements and calculating the film thicknesses
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公开(公告)号:US10186427B2
公开(公告)日:2019-01-22
申请号:US15833184
申请日:2017-12-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyoung Hwan Kim , Ingi Kim , Mihyun Park , Young-Hoo Kim , Ui-soon Park , Jung-Min Oh , Kuntack Lee , Hyosan Lee
IPC: H01L21/311 , H01L21/67
Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.
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公开(公告)号:US20240230528A1
公开(公告)日:2024-07-11
申请号:US18389028
申请日:2023-11-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunhong Jun , Inkeun Baek , Wontae Kim , Namil Koo , Ingi Kim , Sungyoon Ryu , Younghoon Sohn , Yusin Yang , Ikseon Jeon , Eunhyuk Choi
IPC: G01N21/3581 , G01N21/95 , H01L21/66
CPC classification number: G01N21/3581 , G01N21/9501 , H01L22/12
Abstract: A measuring apparatus includes a stage including a transmissive wafer chuck on which a sample wafer is provided, where the sample wafer includes a silicon substrate and at least one material layer on the silicon substrate, a light source unit including a light source configured to generate and output a femtosecond laser beam, and a confocal laser-induced terahertz (THz) emission microscopy (LTEM) unit configured to generate multi-photon excitation by splitting the femtosecond laser beam into four sub-laser beams and causing three sub-laser beams among the four sub-laser beams to be incident in an overlapping manner on a measurement position of the sample wafer, where the confocal LTEM unit is configured to generate the multi-photon excitation based on the three sub-laser beams being incident on a lower surface of the silicon substrate.
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公开(公告)号:US09852921B2
公开(公告)日:2017-12-26
申请号:US15175062
申请日:2016-06-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyoung Hwan Kim , Ingi Kim , Mihyun Park , Young-Hoo Kim , Ui-soon Park , Jung-Min Oh , Kuntack Lee , Hyosan Lee
IPC: G01N15/06 , G01N33/00 , G01N33/48 , H01L21/311 , H01L21/67
CPC classification number: H01L21/31111 , H01L21/67086 , H01L21/67253 , H01L21/67288
Abstract: A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution.
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公开(公告)号:US11946809B2
公开(公告)日:2024-04-02
申请号:US17740529
申请日:2022-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ingi Kim , Minhwan Seo , Sangwoo Bae , Akinori Okubo , Jungchul Lee , Eunhee Jeang
Abstract: Provided is a polarization measuring device including a stage on which a measurement target is provided, a light source assembly configured to emit incident light, a first polarimeter configured to polarize the incident light, a second polarimeter configured to polarize reflected light reflected from the measurement target that is irradiated by the incident light, a filter assembly configured to remove noise from the reflected light, and a detector configured to receive the reflected light and measure an intensity of the reflected light and a phase of the reflected light.
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公开(公告)号:US11823961B2
公开(公告)日:2023-11-21
申请号:US17021087
申请日:2020-09-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunhee Jeang , Boris Afinogenov , Sangwoo Bae , Wondon Joo , Maksim Riabko , Anton Medvedev , Aleksandr Shorokhov , Anton Sofronov , Ingi Kim , Taehyun Kim , Minhwan Seo , Sangmin Lee , Seulgi Lee
CPC classification number: H01L22/12 , G01N21/648 , G01N21/9505 , H01L21/67288 , G01N2201/06113
Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.
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公开(公告)号:US11425833B2
公开(公告)日:2022-08-23
申请号:US16932040
申请日:2020-07-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wooktae Kim , Gyuha Jo , Ingi Kim
Abstract: An electronic device is provided. The electronic device includes a hinge, a first housing connected to the hinge, a second housing connected to the hinge so as to fold the first housing, and a display disposed to receive support of at least a portion of the second housing from at least a portion of the first housing through the hinge. The display includes a display panel, at least one polymer member disposed at a rear surface of the display panel, and a conductive plate disposed at a rear surface of the at least one polymer member. The conductive plate includes a first flat portion facing the first housing, a second flat portion facing the second housing, and a flexible portion configured to connect the first flat portion and the second flat portion and disposed to be bendable. The flexible portion includes support pieces spaced apart from each other through slits, and a conductive elastic member configured to connect electrically and physically the first flat portion, the support pieces, and the second flat portion.
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