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    INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME
    2.
    发明申请
    INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20250098186A1

    公开(公告)日：2025-03-20

    申请号：US18966548

    申请日：2024-12-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jinho Lee ,  Younsoo Kim ,  Haeryong Kim ,  Sunghyun Kim

    IPC: H10B12/00

    Abstract: An integrated circuit (IC) device includes a lower electrode including a first metal, a dielectric film on the lower electrode, and a conductive interface layer between the lower electrode and the dielectric film. The conductive interface layer includes a metal oxide film including at least one metal element. An upper electrode including a second metal is opposite the lower electrode, with the conductive interface layer and the dielectric film therebetween. To manufacture an IC device, an electrode including a metal is formed adjacent to an insulating pattern on a substrate. A conductive interface layer including a metal oxide film including at least one metal element is selectively formed on a surface of the electrode. A dielectric film is formed to be in contact with the conductive interface layer and the insulating pattern.

    Electronic device including housing containing metallic materials
    6.
    发明授权
    Electronic device including housing containing metallic materials 有权

    公开(公告)号：US11159660B2

    公开(公告)日：2021-10-26

    申请号：US16776064

    申请日：2020-01-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Byounghee Choi ,  Yongwook Hwang ,  Changyoun Hwang ,  Jinho Lee ,  Hyeonwoo Lee ,  Youngsoo Jang ,  Yunsung Ha ,  Junghyeon Hwang ,  Minwoo Yoo

    IPC: H04M1/02 ,  G06F1/16 ,  H05K5/04 ,  H05K5/00 ,  H05K5/02 ,  H01Q1/24

    Abstract: Electronic device including first plate including first flat surface portion facing first direction, wherein first plate forms first surface of electronic device; second plate including second flat surface portion facing second direction opposite first direction, wherein second plate forms second surface of electronic device; side member including first metal part including first metallic material and forming at least part of third surface between first surface and second surface and second metal part including second metallic material, wherein second metal part is bonded with first metal part; and display disposed between first plate and the second plate so as to be shown through the first plate, wherein the first metal part and the second metal part form an interface including the first metallic material and the second metallic material, and wherein the interface is configured to face a third direction that is perpendicular to the first direction and the second direction.

    ELECTRONIC DEVICE INCLUDING HOUSING CONTAINING METALLIC MATERIALS
    7.
    发明申请
    ELECTRONIC DEVICE INCLUDING HOUSING CONTAINING METALLIC MATERIALS 审中-公开

    公开(公告)号：US20200252492A1

    公开(公告)日：2020-08-06

    申请号：US16776064

    申请日：2020-01-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Byounghee Choi ,  Yongwook Hwang ,  Changyoun Hwang ,  Jinho Lee ,  Hyeonwoo Lee ,  Youngsoo Jang ,  Yunsung Ha ,  Junghyeon Hwang ,  Minwoo Yoo

    IPC: H04M1/02 ,  G06F1/16 ,  H01Q1/24 ,  H05K5/00 ,  H05K5/02 ,  H05K5/04

    Abstract: Electronic device including first plate including first flat surface portion facing first direction, wherein first plate forms first surface of electronic device; second plate including second flat surface portion facing second direction opposite first direction, wherein second plate forms second surface of electronic device; side member including first metal part including first metallic material and forming at least part of third surface between first surface and second surface and second metal part including second metallic material, wherein second metal part is bonded with first metal part; and display disposed between first plate and the second plate so as to be shown through the first plate, wherein the first metal part and the second metal part form an interface including the first metallic material and the second metallic material, and wherein the interface is configured to face a third direction that is perpendicular to the first direction and the second direction.

    Method for controlling contents and electronic device thereof
    9.
    发明授权
    Method for controlling contents and electronic device thereof 有权

    公开(公告)号：US09973505B2

    公开(公告)日：2018-05-15

    申请号：US14995918

    申请日：2016-01-14

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Okseon Lee ,  Yongseok Park ,  Jinho Lee ,  Youngki Hong

    IPC: G06F21/00 ,  H04L29/06

    CPC classification number: H04L63/10 ,  H04L63/101 ,  H04L63/102

    Abstract: The present disclosure relates to a sensor network, Machine Type Communication (MTC), Machine-to-Machine (M2M) communication, and technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the above technologies, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A method for controlling contents and an electronic device thereof are provided. An operation method of an electronic device includes the operations of setting an access authority for one or more contents, if there is a request for an access of at least one application to the contents, resetting the access authority for the contents, and controlling the access by the application to the contents in accordance with the reset access authority of the application for the contents.

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