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公开(公告)号：US08974393B2
公开(公告)日：2015-03-10
申请号：US13873342
申请日：2013-04-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyung Il Cho , Seung Heun Lee , Bae Hyung Kim , Young Il Kim , Jong Keun Song
CPC classification number: H05K7/20336 , B06B1/0292 , G01N29/2406 , G01N29/326 , H05K1/0204 , H05K2201/064 , H05K2201/09072 , H05K2201/10598
Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.
Abstract translation: 提供了一种超声波探头，其中释放了结合到cMUT的集成电路中产生的热量。 超声波探头包括被配置为产生超声波的换能器，安装在换能器的后表面上的集成电路，安装在集成电路的后表面上的印刷电路板，并且具有开口， 集成电路的后表面至少部分地露出，散热器具有插入印刷电路板的开口中的突起，并且被构造成吸收集成电路中产生的热量，散热模块被配置为释放 散热器吸收的热量到外面。
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公开(公告)号：US09675324B2
公开(公告)日：2017-06-13
申请号：US14301751
申请日：2014-06-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyung Il Cho , Bae Hyung Kim , Young Il Kim , Jong Keun Song , Seung Heun Lee
CPC classification number: A61B8/4427 , A61B8/4444 , A61B8/546 , G01N29/0654 , G01N29/2431
Abstract: A portable ultrasonic probe includes a main body including a transducer to generate an ultrasonic wave and a folder portion including a display portion and pivotally coupled to an end portion of the main body, the main body includes a first heat radiation module configured to absorb and emit heat generated by the transducer, and the folder portion includes a second heat radiation module thermally coupled to the first heat radiation module when the folder portion is in a first position and configured to emit heat transmitted from the first heat radiation module.
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3.发明授权公开(公告)号：US09532767B2
公开(公告)日：2017-01-03
申请号：US13870285
申请日：2013-04-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyung Il Cho , Dong Wook Kim
CPC classification number: A61B8/4444 , A61B8/4477 , A61B8/4494 , B06B1/0622 , G01S15/8913 , G01S15/8925 , Y10T29/49005
Abstract: An ultrasonic probe apparatus and a method of manufacturing the ultrasonic probe apparatus are provided. The ultrasonic probe apparatus may include at least one first tile which transmits an ultrasonic beam toward a target object, and at least one second tile which receives an ultrasonic beam which is reflected from the target object.
Abstract translation: 提供一种超声波探伤装置及其制造方法。 超声波探伤装置可以包括至少一个第一瓦片，其将超声波束朝向目标物体传送，以及至少一个第二瓦片，其接收从目标物体反射的超声波束。
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Patent Agency Ranking
4.发明授权公开(公告)号：US09071893B2
公开(公告)日：2015-06-30
申请号：US13741907
申请日：2013-01-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Young-Il Kim , Dong Wook Kim , Bae Hyung Kim , Jong Keun Song , Seung Heun Lee , Kyung Il Cho
CPC classification number: H04R1/00 , B06B1/0292 , G10K11/004 , H04R31/00 , Y10T29/49005
Abstract: A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.
Abstract translation: 多阵列型超声波探头装置包括发射和接收超声波束的n个瓦片; 以及分别安装有n个瓦片的n个引导部分的基板，以被排列成多阵列。 多阵列超声波探头装置可以在相同的方向和相同的水平上对齐瓦片，以控制发送和接收要在瓦片处发送和接收的超声波束的方向和时间，从而提供稳定的超声波束。
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公开(公告)号：US10660612B2
公开(公告)日：2020-05-26
申请号：US15325263
申请日：2014-07-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyung Il Cho , Jong Keun Song
Abstract: An embodiment of the disclosure provides an ultrasound probe including a single large-area ASIC in which a plurality of ultrasonic transducer elements are bonded. According to an embodiment, an ultrasound probe comprises: a transducer array including a plurality of transducer elements configured to transmit or receive ultrasound; and an integrated circuit, in which the transducer array is bonded, including a plurality of driving elements corresponding to the plurality of transducer elements, wherein the integrated circuit comprises a time delay table configured to output time delay information regarding respective ultrasound transmission and reception of the plurality of transducer elements.
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公开(公告)号：US10327735B2
公开(公告)日：2019-06-25
申请号：US14301540
申请日：2014-06-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyung Il Cho , Jong Keun Song , Bae Hyung Kim , Young Il Kim , Seung Heun Lee
IPC: A61B8/00
Abstract: Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip.
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7.发明授权Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig 有权夹具，其制造方法以及使用夹具的超声波探头芯片的倒装焊接方法公开(公告)号：US09136139B2
公开(公告)日：2015-09-15
申请号：US14607265
申请日：2015-01-28
Applicant: SAMSUNG ELECTRONICS CO., LTD. , Kyungpook National University Industry-Academic Cooperation Foundation
Inventor： Young Il Kim , Bae Hyung Kim , Jong Keun Song , Seung Heun Lee , Kyung Il Cho , Yong Rae Roh , Won Seok Lee
IPC: H01L21/3065 , H01L21/308 , H01L23/00 , H01L21/66
CPC classification number: H01L21/3065 , A61B8/4411 , B06B1/0292 , H01L21/308 , H01L22/12 , H01L24/75 , H01L24/81 , H01L2224/131 , H01L2224/16238 , H01L2224/75744 , H01L2224/75745 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2924/1461 , Y10T156/1702 , H01L2924/00014 , H01L2924/014 , H01L2924/00
Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.
Abstract translation: 夹具包括晶片，其包括配置为在进行倒装芯片接合时容纳电容微机械超声换能器（cMUT）的容纳凹槽和形成在容纳槽的底表面中的分离槽，分离槽具有底表面， 当cMUT位于容纳槽的底部表面的部分上时，与位于分离槽的底表面的cMUT的薄膜间隔开。
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公开(公告)号：US08975096B2
公开(公告)日：2015-03-10
申请号：US13926278
申请日：2013-06-25
Applicant: Samsung Electronics Co., Ltd. , Kyungpook National University Industry-Academic Cooperation Foundation
Inventor： Young Il Kim , Bae Hyung Kim , Jong Keun Song , Seung Heun Lee , Kyung Il Cho , Yong Rae Roh , Won Seok Lee
CPC classification number: H01L21/3065 , A61B8/4411 , B06B1/0292 , H01L21/308 , H01L22/12 , H01L24/75 , H01L24/81 , H01L2224/131 , H01L2224/16238 , H01L2224/75744 , H01L2224/75745 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2924/1461 , Y10T156/1702 , H01L2924/00014 , H01L2924/014 , H01L2924/00
Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.
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