公开(公告)号：US12287984B2

公开(公告)日：2025-04-29

申请号：US18531094

申请日：2023-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonseb Jeong ,  Hongju Kal ,  Won Woo Ro ,  Seokmin Lee ,  Gun Ko

IPC: G06F3/06

Abstract: A data processing system and method for accessing a heterogeneous memory system including a processing unit are provided. The heterogeneous memory system includes a memory module and high bandwidth memory (HBM) including a processing-in-memory (PIM) circuit combined with a memory controller. The memory controller is configured to detect a data array required for an arithmetic operation from a memory module or the HBM by using a border index value when the arithmetic operation is performed by the PIM circuit of the HBM and generate a memory module command set and an HBM command set using physical address spaces respectively designated in the memory module and the HBM.

公开(公告)号：US12107334B2

公开(公告)日：2024-10-01

申请号：US18075850

申请日：2022-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumhee Lee ,  Seungtae Ko ,  Junsig Kum ,  Yoongeon Kim ,  Seokmin Lee ,  Youngju Lee ,  Jongmin Lee ,  Seungho Choi

IPC: H01Q1/24 ,  H01Q21/00

CPC classification number: H01Q21/0006 ,  H01Q1/246

Abstract: The disclosure relates to a fifth generation (5G) or pre-5G communication system supporting higher data rates after a fourth generation (4G) communication system such as Long Term Evolution (LTE). A module in a wireless communication system is provided. The module includes a plurality of antenna elements, an antenna substrate coupled to the plurality of antenna elements, a metal plate coupled to the antenna substrate, a calibration substrate coupled to a Radio Frequency (RF) component on a first face, and a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate. The conductive adhesive material may be coupled to the calibration substrate on a second face different from the first face of the calibration substrate. The conductive adhesive material may include an air gap formed along a signal line included in the calibration substrate.

公开(公告)号：US11880590B2

公开(公告)日：2024-01-23

申请号：US17837286

申请日：2022-06-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonseb Jeong ,  Hongju Kal ,  Won Woo Ro ,  Seokmin Lee ,  Gun Ko

IPC: G06F3/06

CPC classification number: G06F3/0655 ,  G06F3/0604 ,  G06F3/0679

Abstract: A data processing system and method for accessing a heterogeneous memory system including a processing unit are provided. The heterogeneous memory system includes a memory module and high bandwidth memory (HBM) including a processing-in-memory (PIM) circuit combined with a memory controller. The memory controller is configured to detect a data array required for an arithmetic operation from a memory module or the HBM by using a border index value when the arithmetic operation is performed by the PIM circuit of the HBM and generate a memory module command set and an HBM command set using physical address spaces respectively designated in the memory module and the HBM.