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公开(公告)号：US12052541B2
公开(公告)日：2024-07-30
申请号：US18129985
申请日：2023-04-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joonrae Cho , Changshik Yoon , Kiwon Kim , Myeungseon Kim , Taeeon Kim , Myungcheol Lee , Byounghee Lee , Seongkwan Yang , Woojin Cho , Hochul Hwang
CPC classification number: H04R1/288 , H04M1/035 , H04R1/025 , H04R1/2811 , H04R1/2834 , H04R2201/029 , H04R2400/11 , H04R2499/11
Abstract: In various embodiments, an electronic device includes: a diaphragm, a speaker module including a speaker configured to output a sound through a vibration of the diaphragm, and a housing accommodating the diaphragm and the speaker module therein and including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite the first direction. The electronic device further includes an air adsorption member comprising an air adsorbing material disposed in the first space and having a volume ratio of 90% or less of the first space, the air adsorption member configured to reduce air resistance to the diaphragm disposed above the speaker module without limiting the vibration of the diaphragm.
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公开(公告)号：US12133046B2
公开(公告)日：2024-10-29
申请号：US17842107
申请日：2022-06-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hunki Lee , Joonrae Cho , Kiwon Kim , Myeungseon Kim , Choonghyo Park , Seongkwan Yang , Myungcheol Lee , Byounghee Lee , Woojin Cho
CPC classification number: H04R1/288 , H04R1/023 , H04R1/025 , H04R1/028 , H04R1/2826 , H04R2499/11
Abstract: An electronic device is provided. The electronic device includes a speaker module. The speaker module includes an enclosure including a first housing and a second housing and a speaker driver included in the first housing. The second housing includes an adsorption cavity forming a back volume of the speaker driver, a variable structure included in at least a part of the second housing, at least one vent hole for ventilation between the adsorption cavity and an external environment, and a housing cover fixed to the variable structure. The adsorption cavity is filled with an adsorptive filler.
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公开(公告)号：US11237602B2
公开(公告)日：2022-02-01
申请号：US16939688
申请日：2020-07-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Changshik Yoon , Myungcheol Lee , Minsu Rhee , Joonrae Cho , Choonghyo Park , Woojong Jeong , Kiwon Kim , Taeeon Kim , Youngbae Park , Woojin Cho , Hochul Hwang
Abstract: An electronic device is provided. The electronic device includes a housing including a first plate disposed to face a first direction, a second plate disposed to face a second direction opposite to the first direction, and a side member enclosing at least part of a space between the first and second plates and having at least one speaker hole constructed thereon, and a speaker device disposed between the first and second plates to emit a sound through the speaker hole. The speaker device may include: a speaker unit including a yoke disposed to a first face facing the first direction and a diaphragm disposed to a second face facing the second direction, wherein the diaphragm is disposed to face the second direction, and is disposed to face at least part of the second plate, an enclosure shaped to enclose at least part of the speaker unit and disposed between the first and second plates, an acoustic duct constructed between the enclosure and the second plate and extending towards the at least one speaker hole, and a ferromagnetic material disposed between the first plate and the yoke.
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公开(公告)号：US11785126B2
公开(公告)日：2023-10-10
申请号：US17519760
申请日：2021-11-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Choonghyo Park , Kiwon Kim , Myoungsung Sim , Changshik Yoon , Woojin Cho , Joonrae Cho , Hyunggwang Kang , Byounghee Lee , Hochul Hwang
CPC classification number: H04M1/035 , H04M1/0268 , H04M1/0277 , H04R1/345 , H04R2499/11
Abstract: An electronic device according to various embodiments of the disclosure may include: a first housing, a second housing accommodating at least a portion of the first housing and configured to guide sliding movement of the first housing, and an acoustic assembly including an acoustic component comprising acoustic circuitry disposed inside the first housing, a first pipe extending from the acoustic component toward a first end of the first housing, and a second pipe extending from an edge portion of the second housing to a second end of the second housing toward the first housing. The first end of the first housing or the second end of the second housing for connecting the first pipe and the second pipe when the first housing is accommodated in the second housing may be provided in a shape having a specified slope with respect to the edge portion of the second housing.
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公开(公告)号：US11622190B2
公开(公告)日：2023-04-04
申请号：US16909393
申请日：2020-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joonrae Cho , Changshik Yoon , Kiwon Kim , Myeungseon Kim , Taeeon Kim , Myungcheol Lee , Byounghee Lee , Seongkwan Yang , Woojin Cho , Hochul Hwang
Abstract: In various embodiments, an electronic device includes: a diaphragm, a speaker module including a speaker configured to output a sound through a vibration of the diaphragm, and a housing accommodating the diaphragm and the speaker module therein and including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite the first direction. The electronic device further includes an air adsorption member comprising an air adsorbing material disposed in the first space and having a volume ratio of 90% or less of the first space, the air adsorption member configured to reduce air resistance to the diaphragm disposed above the speaker module without limiting the vibration of the diaphragm.
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Patent Agency Ranking
6.发明授权Three-dimensional semiconductor memory device having sidewall and interlayer molds 有权具有侧壁和夹层模具的三维半导体存储器件公开(公告)号：US09418911B2
公开(公告)日：2016-08-16
申请号：US14925789
申请日：2015-10-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae-Joo Shim , Hansoo Kim , Wonseok Cho , Jaehoon Jang , Woojin Cho
IPC: H01L23/52 , H01L23/31 , H01L27/115 , H01L21/768 , H01L23/29 , H01L23/528
CPC classification number: H01L23/3157 , H01L21/76816 , H01L23/291 , H01L23/528 , H01L27/11519 , H01L27/11521 , H01L27/11551 , H01L27/11556 , H01L27/11565 , H01L27/11568 , H01L27/11578 , H01L27/11582 , H01L2924/0002 , H01L2924/00
Abstract: Provided are a three-dimensional semiconductor device and a method of fabricating the same. The three-dimensional semiconductor device may include a mold structure for providing gap regions and an interconnection structure including a plurality of interconnection patterns disposed in the gap regions. The mold structure may include interlayer molds defining upper surfaces and lower surfaces of the interconnection patterns and sidewall molds defining sidewalls of the interconnection patterns below the interlayer molds.
Abstract translation: 提供一种三维半导体器件及其制造方法。 三维半导体器件可以包括用于提供间隙区域的模具结构和包括布置在间隙区域中的多个互连图案的互连结构。 模具结构可以包括限定互连图案的上表面和下表面的层间模具和限定层间模具下面的互连图案的侧壁的侧壁模具。
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公开(公告)号：US09196525B2
公开(公告)日：2015-11-24
申请号：US14276124
申请日：2014-05-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae-Joo Shim , Hansoo Kim , Wonseok Cho , Jaehoon Jang , Woojin Cho
IPC: H01L21/768 , H01L27/115
CPC classification number: H01L23/3157 , H01L21/76816 , H01L23/291 , H01L23/528 , H01L27/11519 , H01L27/11521 , H01L27/11551 , H01L27/11556 , H01L27/11565 , H01L27/11568 , H01L27/11578 , H01L27/11582 , H01L2924/0002 , H01L2924/00
Abstract: Provided are a three-dimensional semiconductor device and a method of fabricating the same. The three-dimensional semiconductor device may include a mold structure for providing gap regions and an interconnection structure including a plurality of interconnection patterns disposed in the gap regions. The mold structure may include interlayer molds defining upper surfaces and lower surfaces of the interconnection patterns and sidewall molds defining sidewalls of the interconnection patterns below the interlayer molds.
Abstract translation: 提供一种三维半导体器件及其制造方法。 三维半导体器件可以包括用于提供间隙区域的模具结构和包括布置在间隙区域中的多个互连图案的互连结构。 模具结构可以包括限定互连图案的上表面和下表面的层间模具和限定层间模具下面的互连图案的侧壁的侧壁模具。
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8.发明申请公开(公告)号：US20140248766A1
公开(公告)日：2014-09-04
申请号：US14276124
申请日：2014-05-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： JAE-JOO SHIM , Hansoo Kim , Wonseok Cho , Jaehoon Jang , Woojin Cho
IPC: H01L21/768
CPC classification number: H01L23/3157 , H01L21/76816 , H01L23/291 , H01L23/528 , H01L27/11519 , H01L27/11521 , H01L27/11551 , H01L27/11556 , H01L27/11565 , H01L27/11568 , H01L27/11578 , H01L27/11582 , H01L2924/0002 , H01L2924/00
Abstract: Provided are a three-dimensional semiconductor device and a method of fabricating the same. The three-dimensional semiconductor device may include a mold structure for providing gap regions and an interconnection structure including a plurality of interconnection patterns disposed in the gap regions. The mold structure may include interlayer molds defining upper surfaces and lower surfaces of the interconnection patterns and sidewall molds defining sidewalls of the interconnection patterns below the interlayer molds.
Abstract translation: 提供一种三维半导体器件及其制造方法。 三维半导体器件可以包括用于提供间隙区域的模具结构和包括设置在间隙区域中的多个互连图案的互连结构。 模具结构可以包括限定互连图案的上表面和下表面的层间模具和限定层间模具下面的互连图案的侧壁的侧壁模具。
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公开(公告)号：US12143795B2
公开(公告)日：2024-11-12
申请号：US17965378
申请日：2022-10-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joonrae Cho , Myeungseon Kim , Myungcheol Lee , Kiwon Kim , Hunki Lee , Woojin Cho
Abstract: An electronic device including a speaker with a porous sheet, a speaker is provided. The electronic device includes a main body, a sound generator, which includes a voice coil, a sound body surrounding the voice coil, and a terminal that is at least partially exposed to an outside of the sound body, a printed circuit board (PCB) connected to the terminal and extending outwardly from the main body, and a porous sheet inserted into the main body and spaced apart from the terminal.
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公开(公告)号：US12022255B2
公开(公告)日：2024-06-25
申请号：US17519753
申请日：2021-11-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Choonghyo Park , Kiwon Kim , Myoungsung Sim , Changshik Yoon , Woojin Cho , Joonrae Cho , Hyunggwang Kang , Byounghee Lee , Sangsoo Park , Hochul Hwang
CPC classification number: H04R1/2826 , G09F9/301 , H04M1/0268 , H04R1/2834 , H04R2400/03 , H04R2499/11
Abstract: According to various embodiments of the disclosure, an electronic device may include: a first housing, a second housing accommodating at least a portion of the first housing and configured to guide sliding movement of the first housing, a flexible display including a first display area disposed on the first housing and a second display area extending from the first display area, a speaker module including a speaker unit including at least one speaker disposed in the second housing and a speaker enclosure accommodating the speaker unit and including a vent hole, and a seal connected to the first housing and the speaker enclosure and configured to be variable based on the sliding movement of the first housing.
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