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公开(公告)号：US20170064870A1
公开(公告)日：2017-03-02
申请号：US15342073
申请日：2016-11-02
Applicant: SanDisk Technologies LLC
Inventor： David A. Wright , David Dean , Robert W. Ellis
CPC classification number: H05K7/20709 , H05K1/0203 , H05K1/0207 , H05K1/0254 , H05K1/0259 , H05K1/181 , H05K7/1489 , H05K7/2039 , H05K7/205 , H05K2201/066 , H05K2201/10159
Abstract: Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system including closely spaced memory modules). Specifically, a heat sink includes an attachment structure and a tab. The attachment structure defines a slot configured to receive an edge of a substrate and thermally couple to a ground plane of the substrate. The tab is located opposite to the slot, and is configured to slide into a card guide slot of an assembly rack, such that in use, heat generated by at least one electronic component on the substrate is at least partially transferred through the ground plane to the attachment structure to be dissipated.
Abstract translation: 本文描述的各种实施例包括用于消散由电子系统（例如，包括紧密间隔的存储器模块的存储器系统）中的电子部件产生的热量的系统，方法和/或设备。 具体地，散热器包括附接结构和突片。 附接结构限定了被配置为接收衬底的边缘并热耦合到衬底的接地平面的槽。 突片位于槽的相对侧并且被配置成滑入组装架的卡引导槽中，使得在使用中，由衬底上的至少一个电子部件产生的热至少部分地通过接地平面传递到 要消散的附件结构。
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公开(公告)号：US09848512B2
公开(公告)日：2017-12-19
申请号：US15342073
申请日：2016-11-02
Applicant: SanDisk Technologies LLC
Inventor： David A. Wright , David Dean , Robert W. Ellis
CPC classification number: H05K7/20709 , H05K1/0203 , H05K1/0207 , H05K1/0254 , H05K1/0259 , H05K1/181 , H05K7/1489 , H05K7/2039 , H05K7/205 , H05K2201/066 , H05K2201/10159
Abstract: Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system including closely spaced memory modules). Specifically, a heat sink includes an attachment structure and a tab. The attachment structure defines a slot configured to receive an edge of a substrate and thermally couple to a ground plane of the substrate. The tab is located opposite to the slot, and is configured to slide into a card guide slot of an assembly rack, such that in use, heat generated by at least one electronic component on the substrate is at least partially transferred through the ground plane to the attachment structure to be dissipated.
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