公开(公告)号：US06448504B1

公开(公告)日：2002-09-10

申请号：US09330939

申请日：1999-06-11

Applicant: Sawori Taguchi

Inventor： Sawori Taguchi

IPC: H05K103

CPC classification number: H05K1/111 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed circuit board with a reinforcing pattern. The printed circuit board includes lands formed in a wiring pattern at positions corresponding to formation positions of external connection electrode terminals, a pattern protective film having openings which are opened at the formation positions of the lands; wherein the diameter of each of the openings of the pattern protective film is set to be larger than the outside diameter of each of the lands, and a reinforcing pattern extends outwardly from the outer peripheral edge of each of the lands and the extension end of the reinforcing pattern is covered with the pattern protective film, thereby preventing occurrence of cracks in solder balls formed on the lands and enhancing the shear strength of the solder balls.

Abstract translation: 具有加强图案的印刷电路板。 印刷电路板包括在与外部连接电极端子的形成位置相对应的位置处形成在布线图案中的焊盘，具有在焊盘的形成位置处开口的开口的图案保护膜; 其中图案保护膜的每个开口的直径设定为大于每个焊盘的外径，并且加强图案从每个焊盘的外周边缘向外延伸，并且， 加强图案被图案保护膜覆盖，从而防止在焊盘上形成的焊球中产生裂缝，并提高焊球的剪切强度。