公开(公告)号：US20170094782A1

公开(公告)日：2017-03-30

申请号：US14863591

申请日：2015-09-24

Applicant: Seagate Technology LLC

Inventor： Kwang Hoon Park

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  B23K35/24 ,  B23K35/362 ,  B23K35/26 ,  B23K35/28 ,  B23K35/30 ,  H05K3/34 ,  B23K35/36

CPC classification number: H05K1/0272 ,  B23K35/24 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K1/111 ,  H05K1/181 ,  H05K1/189 ,  H05K3/3452 ,  H05K3/3457

Abstract: Method and apparatus for establishing an electrical interconnection between an electrical lead and a printed circuit board (PCB), such as a PCB used in a data storage device. In some embodiments, the PCB includes a multi-layer substrate having at least one conductive layer and at least one electrically insulative layer. An electrically conductive pad is provided on a facing surface of the substrate in electrical communication with the at least one conductive layer. A flux reservoir is placed adjacent the pad which extends from the facing surface into the substrate. A solder mask layer is provided on the facing surface of the base structure which surrounds the pad and extends into the reservoir. The solder mask layer and reservoir collect liquid flux from a soldering operation used to form a solder joint between the pad and a conductive lead of an electronic component.

公开(公告)号：US10085338B2

公开(公告)日：2018-09-25

申请号：US14863591

申请日：2015-09-24

Applicant: Seagate Technology LLC

Inventor： Kwang Hoon Park

IPC: H05K1/02 ,  H05K3/34 ,  H05K1/11 ,  H05K1/18 ,  B23K35/36 ,  B23K35/362 ,  B23K35/26 ,  B23K35/28 ,  B23K35/30 ,  B23K35/24

CPC classification number: H05K1/0272 ,  B23K35/0238 ,  B23K35/24 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/282 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K1/111 ,  H05K1/181 ,  H05K1/189 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2201/09063

Abstract: Method and apparatus for establishing an electrical interconnection between an electrical lead and a printed circuit board (PCB), such as a PCB used in a data storage device. In some embodiments, the PCB includes a multi-layer substrate having at least one conductive layer and at least one electrically insulative layer. An electrically conductive pad is provided on a facing surface of the substrate in electrical communication with the at least one conductive layer. A flux reservoir is placed adjacent the pad which extends from the facing surface into the substrate. A solder mask layer is provided on the facing surface of the base structure which surrounds the pad and extends into the reservoir. The solder mask layer and reservoir collect liquid flux from a soldering operation used to form a solder joint between the pad and a conductive lead of an electronic component.