公开(公告)号：US6149443A

公开(公告)日：2000-11-21

申请号：US938787

申请日：1997-09-26

Applicant: Sean A. Moran

Inventor： Sean A. Moran

IPC: H01R12/52 ,  H01R12/71 ,  H01R13/24 ,  H05K3/36 ,  H05K7/14 ,  H05K9/00 ,  H01R9/09 ,  H01R23/68

CPC classification number: H01R13/2435 ,  H01R12/52 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0039 ,  H01R12/714 ,  H05K1/0215 ,  H05K2201/0311 ,  H05K2201/10757 ,  H05K2201/2036

Abstract: A ground connector and standoff apparatus or spring member for mounting between two circuit boards is of conductive material and has opposing substantially flat, parallel first and second legs and a spring link connecting the legs. In an uncompressed condition of the spring member, the legs are spaced apart a predetermined distance greater than the spacing between the two circuit boards when connected together. The first leg is connected to one of the circuit boards and the second leg bears against an opposing portion of the other circuit board to provide a ground connection when the boards are connected together, compressing the spring member. A limiter or spacer on the spring member limits compression beyond a predetermined point at which the height of the spring member is equal to a predetermined standoff between the boards.

Abstract translation: 用于安装在两个电路板之间的接地连接器和支座装置或弹簧构件是导电材料，并且具有相对的基本平坦的平行的第一和第二腿部以及连接腿部的弹簧连杆。 在弹簧构件的未压缩状态下，当彼此连接在一起时，腿部间隔开大于两个电路板之间的间隔的预定距离。 第一腿连接到一个电路板，第二个腿抵靠在另一个电路板的相对部分上，当电路板连接在一起时，提供接地连接，压缩弹簧构件。 弹簧构件上的限制器或间隔件限制压缩超过弹簧构件的高度等于板之间的预定间隔的预定点。

公开(公告)号：US5844784A

公开(公告)日：1998-12-01

申请号：US823774

申请日：1997-03-24

Applicant: Sean A. Moran ,  Jose F. Olivas ,  Thomas J. Chintala

Inventor： Sean A. Moran ,  Jose F. Olivas ,  Thomas J. Chintala

IPC: H05K9/00

CPC classification number: H05K9/0032 ,  Y10S174/34

Abstract: A combined EMI shield and brace assembly has at least two frames for placing side-by-side on a printed wiring board to surround predetermined adjacent areas on the board containing components to be shielded from one another, and a brace member securing the two frames together during reflow. Each frame has a peripheral side wall forming an enclosed area of predetermined shape and dimensions and a portion of the side wall of one frame is placed against a portion of the side wall of the other frame so that the two frames together form an enlarged enclosed area divided into two sub-areas by the adjacent side wall portions extending across the enlarged area. The brace member extends over the frames and is secured to their side walls, and may secure two or more frames together.

Abstract translation: 组合的EMI屏蔽和支架组件具有至少两个框架，用于并排放置在印刷电路板上以围绕板上包含要被屏蔽的部件的预定相邻区域，以及将两个框架固定在一起的支撑构件 在回流期间。 每个框架具有形成预定形状和尺寸的封闭区域的周边侧壁，并且一个框架的侧壁的一部分抵靠另一框架的侧壁的一部分放置，使得两个框架一起形成放大的封闭区域 通过相对于扩大区域延伸的相邻侧壁部分分成两个子区域。 支架构件在框架上延伸并且固定到其侧壁，并且可以将两个或更多个框架固定在一起。

公开(公告)号：US5984697A

公开(公告)日：1999-11-16

申请号：US984443

申请日：1997-12-03

Applicant: Sean A. Moran ,  Roger W. Berg

Inventor： Sean A. Moran ,  Roger W. Berg

IPC: H01R12/52 ,  H01R13/24 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/14 ,  H05K9/00 ,  H01R4/66

CPC classification number: H01R13/2457 ,  H01R12/52 ,  H01R13/24 ,  H05K3/368 ,  H05K3/4015 ,  H05K7/142 ,  H05K9/0016 ,  H05K1/0215 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10962 ,  H05K2201/2036 ,  H05K2201/209 ,  H05K3/341 ,  H05K3/3447 ,  Y02P70/611

Abstract: A ground clip apparatus is designed to make ground contact between two circuit boards as they are mated together. A standoff member is mounted on one of the boards and a spring clip member is mounted on the other board facing the standoff member. The spring clip member has spring arms which are biased against the standoff member when the boards are mated together to make a reliable ground contact. At the same time, the standoff member resists deflection of either board towards the other board.

Abstract translation: 接地夹设备被设计成在两个电路板配合在一起时使接地。 支架构件安装在其中一个板上，并且弹簧夹构件安装在另一个板上，面向支座构件。 弹簧夹构件具有当板被配合在一起以使得可靠的接地接触时偏压抵靠构件的弹簧臂。 同时，支座构件抵抗任一板向另一板的挠曲。

公开(公告)号：US5917708A

公开(公告)日：1999-06-29

申请号：US823773

申请日：1997-03-24

Applicant: Sean A. Moran ,  Jose F. Olivas ,  Thomas J. Chintala

Inventor： Sean A. Moran ,  Jose F. Olivas ,  Thomas J. Chintala

IPC: H05K9/00 ,  H05K7/00

CPC classification number: H05K9/0032 ,  Y10S174/34

Abstract: An EMI shielding apparatus has an outer peripheral wall extending around a combined area of predetermined shape and dimensions for enclosing at least two adjacent areas on a printed wiring board to be shielded from one another. A single transverse wall extends between opposing portions of the peripheral wall to divide the combined area into the two adjacent sub-areas to be shielded from one another. The single transverse wall is of single wall thickness, reducing the EMI shield footprint. The peripheral wall and transverse wall may be formed integrally as one frame, or from two or more adjacent sub-frames.

Abstract translation: EMI屏蔽装置具有围绕预定形状和尺寸的组合区域延伸的外周壁，用于封装印刷线路板上的至少两个相邻区域以彼此屏蔽。 单个横向壁在周壁的相对部分之间延伸，以将组合区域划分成两个相邻的子区域以彼此屏蔽。 单个横壁具有单壁厚度，降低了EMI屏蔽尺寸。 周壁和横壁可以一体地形成为一个框架，也可以从两个或更多个相邻的子框架形成。