公开(公告)号：US08933386B2

公开(公告)日：2015-01-13

申请号：US13669858

申请日：2012-11-06

Applicant: Seiko Instruments Inc.

Inventor： Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Koji Tsukagoshi ,  Keiichiro Hayashi

IPC: G01J1/42 ,  H01L31/0203

CPC classification number: G01J1/42 ,  H01L31/0203 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T156/1039 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is a high-reliability, compact, and low-cost optical sensor device. The optical sensor device includes a glass lid substrate (2), a glass substrate (9) with a cavity having divided and exposed through-hole electrodes (5) on the periphery thereof, and an optical sensor element (3) mounted on the glass lid substrate, and has a structure in which the glass lid substrate and the glass substrate with a cavity are bonded together. By hermetically sealing with the glass substrates, high reliability is secured. By using the divided through-hole electrodes, the package size is reduced and the number of devices which can be produced in a batch in the manufacture increases, which enables cost reduction.

Abstract translation: 提供了高可靠性，紧凑型和低成本的光学传感器装置。 光学传感器装置包括玻璃盖基板（2），具有在其周边上具有分开和暴露的通孔电极（5）的空腔的玻璃基板（9）和安装在玻璃上的光学传感器元件（3） 盖基板，并且具有玻璃盖基板和具有空腔的玻璃基板结合在一起的结构。 通过与玻璃基板气密密封，确保高可靠性。 通过使用分割的通孔电极，封装尺寸减小，并且在制造中可以批量生产的装置的数量增加，这降低了成本。

公开(公告)号：US09029968B2

公开(公告)日：2015-05-12

申请号：US13676404

申请日：2012-11-14

Applicant: Seiko Instruments Inc.

Inventor： Koji Tsukagoshi ,  Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi

IPC: H01L31/0232 ,  G01J1/44 ,  G01J1/02 ,  G01J1/42

CPC classification number: G01J1/44 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/42

Abstract: An optical sensor element is mounted in a package which includes a glass substrate having a cavity, and a glass lid substrate bonded to the other substrate to close the cavity. The glass substrate with the cavity has metalized wiring patterns on front and rear surfaces thereof, and a through hole filled with metal to form a through-electrode interconnecting the wiring patterns on the front and rear surfaces. A metalized wiring pattern on the rear surface of the glass lid substrate is electrically connected to the wiring pattern on the front surface of the other substrate with an adhesive containing conductive particles. The glass lid substrate is made either of glass having a filter function or glass having a light shielding property with an opening therethrough filled with glass having a filter function.

Abstract translation: 光学传感器元件安装在包括具有空腔的玻璃基板的封装中，并且将玻璃盖基板粘合到另一基板上以封闭空腔。 具有空腔的玻璃基板在其前表面和后表面上具有金属化布线图案，以及填充有金属的通孔，以形成将前后表面上的布线图案互连的贯通电极。 玻璃盖基板的后表面上的金属化布线图案与含有导电性粒子的粘合剂电连接到另一基板的前表面上的布线图案。 玻璃盖基板由具有过滤功能的玻璃或具有遮光性的玻璃制成，其中具有过滤功能的玻璃填充有开口。